The **ATS-08F-133-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, commonly used to cool chips such as CPUs, GPUs, or other power-dense electronic components. --- ## 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (AL6063) | | **Dimensions** | 70.00mm x 70.00mm x 10.00mm | | **Fin Type** | Fine Pitch (Cross-Cut) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 2.11°C/W (at 200 LFM) | | **Finish** | Blue Anodized | --- ## 2. Key Component Features ### A. Fin Geometry (Cross-Cut) The "08F" in the part number indicates a specific fin pattern. The cross-cut design increases surface area and creates turbulence in the airflow, which significantly improves heat dissipation efficiency compared to standard straight-fin heatsinks. ### B. pushPIN™ Attachment System This part utilizes a specialized mounting mechanism: * **Compression Springs:** Provides precise pressure to ensure maximum thermal contact between the heatsink and the electronic chip. * **Plastic/Brass Push Pins:** Designed to snap into pre-drilled holes on the PCB (Printed Circuit Board). ### C. Thermal Interface Material (TIM) The **C2** in the suffix indicates that the heatsink comes pre-applied with **T766 thermal phase change material**. This eliminates the need for manual thermal paste application and ensures a low-resistance path for heat to travel from the component to the aluminum fins. --- ## 3. Usage Context This heatsink is typically found in: 1. **Telecommunications:** High-speed routers and switches. 2. **Embedded Systems:** Industrial PCs where vertical space is limited (low profile 10mm height). 3. **Power Electronics:** Cooling MOSFETs or small power modules.