The **ATS-08F-08-C3-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS) as part of their "pushPIN™" series. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm x 17.5mm | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 14.61°C/W (Unducted Flow @ 100 LFM) | | **Fin Style** | Fine Pitch (Cross-Cut) | | **Thermal Interface** | T412 (High-performance Phase Change Material) | --- ### 2. Key Components & Design #### A. The Heat Sink Body The body is constructed from high-grade aluminum. It uses a **fine-pitch cross-cut pattern**, which maximizes surface area for heat dissipation while maintaining low pressure drop for airflow. #### B. The pushPIN™ Attachment Unlike adhesive tapes or simple clips, this part uses a precision spring-loaded pin mechanism. * **Benefits:** Ensures constant, uniform pressure on the electronic component (CPU, GPU, or FPGA), which optimizes thermal transfer. * **Compatibility:** Designed for pre-drilled holes in the PCB. #### C. Thermal Interface Material (TIM) The "C3" designation indicates it comes pre-applied with **T412 thermal material**. This is a phase-change material that melts during operation to fill microscopic air gaps between the heat sink and the chip, significantly reducing thermal resistance. --- ### 3. Application Use Cases This specific model is typically used for cooling mid-range integrated circuits (ICs) that generate significant heat in restricted spaces: 1. **Telecommunications:** Cooling network switches and routers. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Cooling high-speed voltage regulators or transistors. --- ### 4. Thermal Performance Data *Measured in °C/W (Degrees Celsius per Watt):* | Airflow Velocity (LFM) | 100 | 300 | 500 | 700 | | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance** | 14.61 | 4.02 | 2.21 | 1.63 | ---