The **ATS-08F-07-C3-R0** is a specific part number for a **High-Performance Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed for cooling electronic components like CPUs, GPUs, and other high-heat-generating integrated circuits. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Heat Sink Type** | Push Pin style | | **Material** | Aluminum (Anodized Blue) | | **Fin Style** | Straight Fin (Extruded) | | **Thermal Resistance** | ~17.09 °C/W (Unducted Flow @ 200 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 12.7mm | | **Attachment Method** | Push Pin with Brass Springs | | **Thermal Interface Material (TIM)** | T412 (Phase change/Thermal pad) | --- ### 2. Breakdown of the Part Number The alphanumeric code follows a specific logic used by ATS to identify the physical characteristics: * **ATS-08**: Refers to the physical series/form factor. * **F**: Refers to the fin pitch/density (Fine). * **07**: Specific height and dimension code. * **C3**: Indicates the color/finish and material (typically blue anodized aluminum). * **R0**: Version or Revision indicator. --- ### 3. Key Electronic Functions While the heat sink itself is a passive mechanical component, it serves critical electronic purposes: * **Thermal Dissipation:** It increases the surface area of the component (e.g., an FPGA or ASIC), allowing heat to transfer to the surrounding air via convection. * **Thermal Protection:** By maintaining the junction temperature ($T_j$) of the silicon, it prevents thermal throttling and permanent hardware failure. * **EMI Shielding (Partial):** Because it is an anodized aluminum plate grounded via the PCB mounting holes, it can occasionally assist in reducing electromagnetic interference, though this is not its primary function. --- ### 4. Mounting & Attachment This part utilizes a **Push-Pin** mechanism. This is preferred in industrial electronics because: 1. **Uniform Pressure:** The springs ensure consistent contact between the chip and the heat sink. 2. **Vibration Resistance:** Unlike adhesive tapes, push pins are secure in high-vibration environments (e.g., aerospace or automotive). 3. **Pre-applied TIM:** The "T412" coating on the bottom eliminates the need for manual thermal paste application during assembly.