The **ATS-08F-05-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed for cooling high-power semiconductors. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Product Series** | maxiFLOW™ | | **Attachment Method** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | 5.84 °C/W @ 100 LFM (0.5 m/s) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 25.00mm | | **Fin Style** | XC (Cross-Cut) | --- ### 2. Key Electronic Features #### A. Thermal Resistance Efficiency The device is engineered to dissipate heat from integrated circuits (ICs), CPUs, or GPUs. The "Cross-Cut" (XC) fin pattern allows for multidirectional airflow, meaning it remains effective even if the air is not hitting the heatsink perfectly straight. #### B. pushPIN™ Mounting System The part utilizes the proprietary **pushPIN™** system. This replaces traditional adhesive tapes with a mechanical fastener: * **Compression Spring:** Ensures even pressure across the component surface for maximum heat transfer. * **Plastic/Brass Pins:** Secure the heatsink directly to the PCB through pre-drilled holes. #### C. Material Science The **Blue Anodized** finish is not just aesthetic. Anodization increases the surface emissivity, which improves heat radiation and protects the aluminum from environmental corrosion. --- ### 3. Physical Dimensions (mm) | Dimension | Value (mm) | | :--- | :--- | | **Length (A)** | 40.00 | | **Width (B)** | 40.00 | | **Height (C)** | 25.00 | | **Pitch (E)** | 33.00 | | **Pitch (F)** | 33.00 | --- ### 4. Application Use-Cases * **Telecom Hardware:** High-speed routers and switches. * **Power Supplies:** Cooling MOSFETs and voltage regulators. * **Embedded Systems:** Industrial PCs where space is limited but thermal loads are high.