The **ATS-08E-72-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling processors and other surface-mount components. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the dimensions, fin style, and material properties. | Feature | Specification | | :--- | :--- | | **Product Type** | Heat Sink | | **Attachment Method** | Push Pin (Plastic) | | **Fin Type** | straight (High-performance) | | **Material** | Aluminum (Blue Anodized) | | **Base Dimensions** | 45mm x 45mm | | **Height** | 15.00mm | | **Thermal Resistance** | ~5.11°C/W (at 1.0 m/s airflow) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Electronic Components & Design While the heat sink itself is mechanical, its "electronic" relevance lies in how it interacts with the PCB (Printed Circuit Board): * **Thermal Interface Material (TIM):** The unit comes with **T766** pre-applied to the bottom. This is a phase-change or high-conductivity material that fills microscopic air gaps between the electronic chip (CPU/GPU/FPGA) and the aluminum base to maximize heat transfer. * **The Push Pin Mechanism:** It uses a spring-loaded push pin system. This ensures consistent "clamping pressure" (load) on the electronic package, which is critical for maintaining thermal contact without cracking the delicate silicon die. * **Fin Geometry:** The "straight-fin" design is optimized for environments where there is a dedicated fan or directional airflow. The fin density is calculated to provide maximum surface area while minimizing pressure drop. --- ### 3. Application Use Cases This specific part is typically used in the following electronic assemblies: 1. **Network Switches/Routers:** Cooling high-speed processing chips. 2. **Embedded Systems:** Industrial PCs where vertical space (15mm) is limited. 3. **Power Supplies:** Heat dissipation for MOSFETs or Power Modules. 4. **FPGA/ASIC Cooling:** Providing thermal stability for custom logic chips. --- ### 4. Part Number Breakdown The code **ATS-08E-72-C2-R0** can be decoded as follows: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **08:** Series designation (typically relates to mounting hole patterns). * **E:** Fin pattern/material code. * **72:** Specific dimension/height identifier. * **C2:** Material/Finish (Blue Anodized Aluminum). * **R0:** Revision/Packaging code.