The **ATS-08E-182-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series designed for thermal management of electronic components. ### 1. Technical Specifications The part number encodes specific physical and material characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 40.00 mm x 40.00 mm | | **Height** | 15.00 mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 7.51 °C/W (at 100 LFM) | | **Fin Pattern** | Fine-pitch (Straight) | --- ### 2. Electronic Application & Function Heat sinks like the ATS-08E-182-C2-R0 are critical for maintaining the reliability of active electronic components. * **Heat Dissipation:** It increases the surface area of a hot component (like a CPU, GPU, or MOSFET), allowing air to carry away heat more efficiently. * **Protection:** By keeping junction temperatures within safe limits, it prevents **thermal throttling** (where a chip slows down to cool off) and permanent hardware failure. * **Attachment:** The `C2` in the part number indicates a specific spring and pin combination that provides a consistent pressure (TIM - Thermal Interface Material optimization) against the chip for better heat transfer. --- ### 3. Part Number Breakdown The nomenclature used by Advanced Thermal Solutions for this model follows this logic: * **ATS-08E:** Series identification. * **182:** Specific internal geometry/fin configuration. * **C2:** Thermal Interface Material (TIM) and Spring type (typically T766 phase-change material). * **R0:** Revision or packaging code. --- ### 4. Implementation Example When integrating this into a PCB design, the mechanical engineer must ensure the hole pattern on the PCB matches the pushPIN™ spacing: ```markdown Pitch Spacing: 33.00 mm x 33.00 mm Hole Size: ~3.00 mm Recommended TIM: T766 (Pre-applied) ```