## Technical Overview of ATS-08D-95-C2-R0 The **ATS-08D-95-C2-R0** is a high-performance electronic thermal management component manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically a **heat sink** designed for cooling integrated circuits (ICs) and other electronic surface-mount devices. --- ### 1. Key Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal properties. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 7.29 °C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Weight** | ~50 grams | --- ### 2. Physical Design & Composition * **Fin Style:** This model typically utilizes a **fine-pitch straight fin** or **cross-cut** design. This increases the surface area available for heat dissipation while maintaining a compact footprint. * **Material (Aluminum):** Provides an excellent balance between thermal conductivity and weight, ensuring it doesn't put excessive mechanical stress on the PCB. * **Blue Anodized Coating:** The blue finish is not just aesthetic; anodization protects the aluminum from corrosion and slightly improves radiant heat transfer. --- ### 3. Attachment Mechanism: pushPIN™ One of the defining "electronic parts" of this assembly is the mounting hardware. Instead of using messy thermal adhesives or tapes, it uses the **pushPIN™ system**: 1. **Compression Springs:** These provide precise, uniform pressure across the thermal interface material (TIM). 2. **Brass or Plastic Pins:** These snap into pre-drilled holes in the PCB, ensuring the heat sink stays securely attached even during vibration or shipping. 3. **Thermal Interface Material (TIM):** The base is usually pre-applied with a high-performance thermal pad or grease (often **T766**), which fills microscopic air gaps between the component and the heat sink. --- ### 4. Performance Context The **ATS-08D-95-C2-R0** is engineered for "high-flow" environments. Its thermal resistance drops significantly as airflow (measured in Linear Feet per Minute - LFM) increases: ```text Airflow (LFM) | Thermal Resistance (°C/W) ----------------------------------------- 100 | 7.29 200 | 2.48 300 | 1.67 400 | 1.31 ``` --- ### Summary of Use Cases * **Processor Cooling:** Small CPUs or GPUs in embedded systems. * **Power Electronics:** Cooling MOSFETs or high-speed voltage regulators. * **Telecommunications:** Used in routers and switches where airflow is consistently managed.