The **ATS-08D-86-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications Below are the primary electronic and physical parameters for this specific part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance (Flowing Air)** | 1.83°C/W @ 200 LFM | | **Thermal Resistance (Static Air)** | 6.71°C/W | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 15.00mm | | **Fin Style** | Straight (Square-cut) | | **Spring Type** | Compression Spring | --- ### 2. Key Electronic Features * **Push-Pin Mounting:** This part uses a specialized mechanical attachment system. It involves a plastic pin and a compression spring that passes through pre-drilled holes in a Printed Circuit Board (PCB). This ensures consistent pressure on the electronic component, which is critical for efficient heat transfer. * **Thermal Interface Material (TIM):** The "R0" suffix usually indicates that the heat sink comes with a pre-applied high-performance thermal interface material (like T766). This fills the microscopic air gaps between the heat sink and the electronic chip to improve thermal conductivity. * **Blue Anodized Finish:** Beyond aesthetics, the anodization provides a layer of electrical insulation and improves radiant heat transfer. --- ### 3. Application Use Cases This heat sink is typically found in the following electronic environments: 1. **Networking Hardware:** Routers, switches, and modems. 2. **Power Electronics:** Voltage regulators and high-current power supplies. 3. **Embedded Computing:** Industrial PC modules and single-board computers (SBCs). --- ### 4. Thermal Performance Data Electronic engineers use the following air-flow data to calculate if this heat sink is sufficient for a specific chip's TDP (Thermal Design Power): ```text Air Velocity (LFM) | Thermal Resistance (°C/W) -------------------|-------------------------- 200 | 1.83 300 | 1.55 400 | 1.38 500 | 1.26 600 | 1.17 ```