The **ATS-08D-82-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is designed for cooling electronic components, specifically those in BGA (Ball Grid Array) packages. --- ### 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 30mm x 30mm x 15mm | | **Thermal Resistance** | 10.79°C/W (at 100 LFM) | | **Attachment Method** | pushPIN™ | | **Flow Direction** | Vertical-Fin (Cross-Cut) | --- ### 2. Key Electronic & Mechanical Design Features #### A. Thermal Management Performance This heat sink is designed for **forced air cooling**. The efficiency of heat dissipation varies based on the airflow (LFM - Linear Feet per Minute): * **100 LFM:** 10.79°C/W * **500 LFM:** 4.15°C/W * The significant drop in thermal resistance at higher airflows makes it ideal for server or networking environments with active fan cooling. #### B. The pushPIN™ Attachment System The "82" in the part number refers to the specific attachment style. The **pushPIN™** system provides: * **Constant Pressure:** A pre-assembled compression spring ensures firm contact between the heat sink and the electronic component (CPU, GPU, or FPGA). * **Vibration Resistance:** Secure mounting that prevents the heat sink from shifting during transport or operation. * **Plastic Push Pins:** These snap into 3mm diameter holes on the PCB. #### C. Thermal Interface Material (TIM) The **C2** designation indicates that this model typically comes with **T766** thermal phase change material or a similar high-performance grease pre-applied to the base. This ensures there are no air gaps between the chip surface and the aluminum base, maximizing heat transfer. --- ### 3. Common Applications * **Integrated Circuits (ICs):** Cooling high-speed processors or chipsets. * **Telecommunications:** Used on PCB boards within routers and switches. * **Power Supplies:** Heat dissipation for power transistors or voltage regulators. ---