The **ATS-08D-77-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to their high-performance "push pin" heat sink series. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part number: | Feature | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions** | 25mm x 25mm x 20mm | | **Thermal Resistance** | 9.30°C/W @ 100 LFM | | **Fin Style** | Straight Fin | | **Weight** | ~10.4 Grams | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **08**: Product Family (Push-Pin series). * **D**: Material/Style indicator. * **77**: Specific profile/size code (25mm x 25mm). * **C2**: Thermal Interface Material (TIM) code. "C2" typically indicates **T766** (a high-performance thermal grease applied to the base). * **R0**: Revision or packaging code. --- ### 3. Key Electronic Functions While the heat sink itself is a passive mechanical part, its role in an electronic circuit is critical for **Thermal Management**: 1. **Heat Dissipation:** It increases the surface area of a semiconductor (like a BGA, FPGA, or MOSFET), allowing the heat generated by the electronic junctions to be transferred to the surrounding air. 2. **Thermal Interface:** The "C2" suffix means it comes with pre-applied thermal material, ensuring there are no air gaps between the hot chip and the aluminum base. 3. **Mechanical Stability:** The push-pin mechanism uses a spring-loaded design to provide consistent pressure on the chip, which prevents the heat sink from shifting due to vibration or thermal expansion. --- ### 4. Typical Applications * **Embedded Systems:** Cooling small processors in industrial computers. * **Telecommunications:** Dissipating heat from high-speed networking chips. * **Power Electronics:** Managing heat on power-dense surface-mount components.