The **ATS-08D-75-C1-R0** is a specific part number for a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed for cooling electronic components like CPUs, GPUs, and high-power chipsets. --- ## 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | ~14.95°C/W (at 100 LFM) to ~1.43°C/W (at 700 LFM) | | **Thermal Interface Material (TIM)** | Pre-applied T766 (High Performance) | --- ## 2. Physical Dimensions Precision sizing is critical for ensuring the heatsink fits within the circuit board's "keep-out" zones. | Dimension | Value | | :--- | :--- | | **Length/Width (Base)** | 25.00 mm x 25.00 mm | | **Height (Fin Profile)** | 30.00 mm | | **Pitch (Hole-to-Hole)** | 30.00 mm | | **Weight** | ~28 grams | --- ## 3. Key Electronic Cooling Features ### A. High Aspect Ratio Fins The heatsink utilizes a straight-fin design that maximizes surface area. In electronic cooling, this is vital for dissipating heat generated by the semiconductor die into the ambient air via forced convection (fan-driven airflow). ### B. Push-Pin Attachment Mechanism Instead of using messy adhesives or permanent solder, this part uses a **plastic push-pin and spring** system: * **Reliability:** Ensures consistent pressure (clamping force) on the chip. * **Ease of Repair:** Allows for the heatsink to be removed and the TIM to be reapplied if the board requires maintenance. * **Vibration Resistance:** The spring provides a degree of mechanical decoupling, protecting the chip during transport. ### C. Pre-applied TIM (Thermal Interface Material) The **T766** material pre-applied to the base fills microscopic air gaps between the component and the heatsink. This significantly reduces "Contact Resistance," which is the biggest bottleneck in cooling small electronic parts. --- ## 4. Common Applications * **Embedded Systems:** Cooling industrial microcontrollers. * **Networking:** Heat management for small switches and routers. * **Power Electronics:** Dissipating heat from MOSFET arrays or Voltage Regulator Modules (VRMs).