### Overview of ATS-08D-56-C2-R0 The **ATS-08D-56-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is specifically designed for cooling electronic components such as CPUs, GPUs, FPGAs, and ASICs. While it does not have internal circuitry, it is a critical "passive" electronic part used for thermal management. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Product Series** | pushPIN™ Heat Sink Assembly | | **Attachment Type** | Push-pin (Spring-loaded) | | **Material** | Aluminum (Body) / Blue Anodized (Finish) | | **Thermal Resistance** | 17.72 °C/W (Unducted Flow @ 100 LFM) | | **Dimensions** | 40.00mm x 40.00mm x 10.00mm | | **Pitch** | Fine Pitch (Increases surface area) | --- ### Core Electronic & Mechanical Components #### 1. The Heat Sink Body The main body is constructed from high-grade aluminum. It uses a **Straight Fin** design which is optimized for airflow directed through the fins. The 10mm height makes it a "low-profile" solution, ideal for compact PCB layouts where vertical space is limited. #### 2. Attachment Mechanism (pushPIN™) Instead of messy adhesives or simple clips, this model uses a **push-pin and spring** assembly: * **Springs:** Pre-installed stainless steel springs ensure consistent pressure (load) on the electronic component, which is vital for efficient heat transfer. * **Push-pins:** These provide a secure mechanical connection to the PCB, preventing the heat sink from shifting during vibration or shipping. #### 3. Thermal Interface Material (TIM) The "C2" in the part number indicates the type of Thermal Interface Material pre-applied to the base. * **T766 Phase Change Material:** This is a high-performance thermal grease or pad applied to the bottom. When the electronic part heats up, the material softens to fill microscopic air gaps between the chip and the heat sink. --- ### Thermal Performance Data Effective cooling depends on the airflow (Measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (Unducted) | | :--- | :--- | :--- | | 100 | 0.5 | 17.72 °C/W | | 300 | 1.5 | 6.29 °C/W | | 500 | 2.5 | 4.47 °C/W | | 700 | 3.5 | 3.63 °C/W | --- ### Application Summary This part is commonly found in: * **Telecommunications:** Cooling signal processors. * **Embedded Systems:** Industrial PCs with limited airflow. * **Power Supplies:** Cooling MOSFETs or Voltage Regulators. ---