The **ATS-08D-41-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. Below is a detailed breakdown of its technical specifications and physical characteristics. --- ### 1. General Specifications The part belongs to the **Advanced Thermal Solutions (ATS)** "blueICE" series, known for its high-efficiency thermal performance in compact spaces. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Number** | ATS-08D-41-C2-R0 | | **Type** | Board Level, Heatsink (Push-Pin Mount) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 10.02°C/W (Unducted Flow @ 200 LFM) | --- ### 2. Mechanical Dimensions Precision in dimensions is critical for PCB layout and ensuring there is no interference with surrounding components. | Dimension | Measurement | | :--- | :--- | | **Length** | 45.00 mm | | **Width** | 45.00 mm | | **Height (Fin Height)** | 17.78 mm | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Spring Type** | Compression Spring | --- ### 3. Key Electronic Cooling Features #### A. Fin Design The "41" series typically utilizes a **Straight Fin** or **Cross-Cut** design. This allows for optimal airflow in one or multiple directions, significantly reducing the junction temperature of the underlying semiconductor. #### B. Attachment System (Push-Pin) This part uses a **Push-Pin** mounting mechanism. In electronics: * **Ease of Assembly:** It allows for quick installation onto the PCB. * **Reliability:** The compression spring ensures constant pressure between the heatsink and the component (like a BGA or CPU), maximizing heat transfer. * **Pre-Drilled Holes:** The PCB must have specific hole layouts to accommodate the pins. #### C. Thermal Interface Material (TIM) The "C2" suffix typically indicates that the heatsink comes with a **Pre-applied Thermal Interface Material**. This is a phase-change or high-conductivity pad that fills microscopic air gaps between the chip and the aluminum, drastically improving cooling efficiency. --- ### 4. Thermal Performance Data Electronic components fail if they exceed their maximum operating temperature ($T_j$). The ATS-08D-41-C2-R0 provides the following cooling rates based on Airflow (LFM - Linear Feet per Minute): * **@ 200 LFM:** 10.02 °C/W * **@ 400 LFM:** 4.10 °C/W * **@ 600 LFM:** 2.90 °C/W *Note: Higher airflow results in lower thermal resistance, allowing the electronic part to run faster or more reliably.* ---