ATS-08D-38-C2-R0
AI

The **ATS-08D-38-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from surface-mount components like CPUs, GPUs, or FPGAs.
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### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of this specific part:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum (Blue Anodized) |
| **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 23.00mm |
| **Fin Style** | Straight (Fine Pitch) |
| **Thermal Resistance** | 6.42°C/W (Unducted Flow @ 100 LFM) |
| **Attachment Method** | Push-Pin (Brass) |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Key Features and Electronic Functionality
#### A. Thermal Dissipation
This part is a "passive" electronic component. Its primary role is to increase the surface area of a heat-generating semiconductor. The **fine-pitch fin design** allows for maximum heat transfer in systems with forced air (fans).
#### B. Push-Pin Attachment Mechanism
The "08D" and "R0" designations often refer to the specific mounting hardware.
- **Reliability:** The brass push-pin provides a consistent, high-tension force across the component.
- **Safety:** It prevents the heat sink from shifting during vibration or shipping, which is critical for maintaining the integrity of the solder joints on the chip below.
#### C. Thermal Interface Material (TIM)
The unit comes with **T766** pre-applied. In electronics, the TIM is crucial because it fills microscopic air gaps between the chip die and the aluminum heat sink, ensuring efficient thermal conductivity.
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### 3. Application Use Cases
This specific heat sink is typically found in:
* **Networking Gear:** Switches and routers where high-speed processors generate significant heat.
* **Embedded Systems:** Industrial PCs or controllers.
* **Power Supplies:** Cooling high-output MOSFETs or voltage regulators.
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- ⤷What is the difference between ducted and unducted thermal resistance for this part?
- ⤷ How does the T766 interface material compare to standard thermal grease?
- ⤷ Can this heat sink be used with components smaller than 40mm x 40mm?