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  • ATS-08D-38-C2-R0

  • AI
    The **ATS-08D-38-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from surface-mount components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 23.00mm | | **Fin Style** | Straight (Fine Pitch) | | **Thermal Resistance** | 6.42°C/W (Unducted Flow @ 100 LFM) | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Features and Electronic Functionality #### A. Thermal Dissipation This part is a "passive" electronic component. Its primary role is to increase the surface area of a heat-generating semiconductor. The **fine-pitch fin design** allows for maximum heat transfer in systems with forced air (fans). #### B. Push-Pin Attachment Mechanism The "08D" and "R0" designations often refer to the specific mounting hardware. - **Reliability:** The brass push-pin provides a consistent, high-tension force across the component. - **Safety:** It prevents the heat sink from shifting during vibration or shipping, which is critical for maintaining the integrity of the solder joints on the chip below. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied. In electronics, the TIM is crucial because it fills microscopic air gaps between the chip die and the aluminum heat sink, ensuring efficient thermal conductivity. --- ### 3. Application Use Cases This specific heat sink is typically found in: * **Networking Gear:** Switches and routers where high-speed processors generate significant heat. * **Embedded Systems:** Industrial PCs or controllers. * **Power Supplies:** Cooling high-output MOSFETs or voltage regulators. ---
    ✨ Follow-up Questions
    • ⤷What is the difference between ducted and unducted thermal resistance for this part?
    • ⤷ How does the T766 interface material compare to standard thermal grease?
    • ⤷ Can this heat sink be used with components smaller than 40mm x 40mm?