The **ATS-08D-34-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heat Sink** designed for cooling electronic integrated circuits (ICs) like CPUs, GPUs, or FPGAs. ### 1. Technical Specifications The part number follows a specific nomenclature used by Advanced Thermal Solutions. Below are the primary specifications for this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. | | **Product Type** | Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 30.00mm | | **Thermal Resistance** | 6.73°C/W (at 100 LFM) | | **Flow Orientation** | Cross-cut (Multiple directions) | --- ### 2. Design and Component Breakdown #### A. Fin Geometry The "34" series features **rectangular fins** in a cross-cut pattern. This design allows for high surface area contact with the air while supporting airflow from multiple directions, making it ideal for systems where the airflow path is not strictly linear. #### B. pushPIN™ Attachment System One of the most critical "electronic parts" of this assembly is the attachment mechanism. Instead of messy adhesives, it uses: * **Brass/Plastic Pins:** Spring-loaded pins that snap into pre-drilled holes on the PCB. * **Compression Springs:** These provide precisely calculated "force" (pressure) to ensure maximum thermal transfer without cracking the silicon die. #### C. Thermal Interface Material (TIM) The "R0" suffix usually denotes the inclusion of a pre-applied **Thermal Interface Material**. This is a high-conductivity pad or phase-change material on the bottom of the heat sink that fills microscopic air gaps between the chip and the aluminum base. --- ### 3. Usage Context This part is commonly found in: 1. **Networking Equipment:** Routers and switches with high-density chips. 2. **Industrial PCs:** Where vibration resistance is needed (the pushPIN system is more secure than tape). 3. **Power Electronics:** Cooling MOSFETs or power regulators. --- ### 4. Thermal Performance Data (Example) Thermal resistance varies based on air velocity (Measured in LFM - Linear Feet per Minute): | Airflow (LFM) | Velocity (m/s) | Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 6.73 | | 300 | 1.5 | 2.22 | | 500 | 2.5 | 1.60 |