The **ATS-08D-33-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. It is manufactured by *Advanced Thermal Solutions, Inc.* --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Attachment Type** | Push-Pin (Plastic or Brass) | | **Base Dimensions** | 35.00mm x 35.00mm | | **Height** | 20.00mm | | **Fin Style** | Straight / Vertical Fins | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 17.42°C/W (at 100 LFM) to 1.67°C/W (at 700 LFM) | --- ### 2. Key Components & Materials * **Aluminum 6063:** This is the primary material used for the heatsink body. It provides a balance of high thermal conductivity and structural integrity. * **Push-Pin Attachment:** The "R0" at the end typically signifies a specific push-pin and spring kit. This mechanism ensures consistent pressure (clamping force) between the heatsink and the component, optimizing heat transfer. * **Phase Change Material (TIM):** Most units in this series come pre-applied with a Thermal Interface Material (TIM) on the base to fill microscopic air gaps between the heatsink and the chip. * **Blue Anodization:** This is not just for aesthetics; the anodized coating protects the aluminum from corrosion and slightly improves radiant heat emission. --- ### 3. Thermal Performance Data Thermal resistance indicates how effectively the part moves heat away from the electronic component. Performance improves as airflow (measured in Linear Feet per Minute - LFM) increases: | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 17.42 | | 300 | 4.13 | | 500 | 2.50 | | 700 | 1.67 | --- ### 4. Application Use Cases This specific part is generally used in: 1. **Telecommunications:** Cooling for routers and switches. 2. **Embedded Systems:** High-heat generating processors on PCBs. 3. **Power Electronics:** Cooling MOSFETs or small voltage regulators. 4. **Industrial PCs:** Compact computing modules requiring passive or active airflow cooling. ---