ATS-08D-30-C2-R0
AI

The **ATS-08D-30-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) and surface-mount devices (SMDs).
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### 1. Key Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. |
| **Series** | pushPIN™ |
| **Material** | Aluminum (AL6063) |
| **Attachment Method** | Push-Pin (Plastic or Brass) |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 5.31°C/W (at 100 LFM) |
| **Dimensions (LxWxH)** | 35.00mm x 35.00mm x 25.00mm |
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### 2. Physical Design & Features
#### **Fin Geometry (Cross-Cut)**
The part utilizes a **cross-cut** fin design. This allows for multi-directional airflow, making it ideal for systems where the direction of the cooling air may change or where the airflow is turbulent. This provides better thermal efficiency compared to traditional straight-fin designs.
#### **Attachment System (pushPIN™)**
The "08D" in the part number refers to the specific attachment mechanism.
* **Ease of Installation:** It uses a spring-loaded push-pin mechanism that ensures constant pressure against the chip for optimal heat transfer.
* **Compression Springs:** These provide the necessary clamping force to maintain thermal interface material (TIM) contact without damaging the PCB.
#### **Material and Finish**
* **AL6063:** A common aluminum alloy known for high thermal conductivity and excellent corrosion resistance.
* **Blue Anodized:** The surface treatment increases the surface area at a microscopic level (improving radiation) and protects the metal from oxidation.
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### 3. Performance Analysis (Thermal Resistance)
Thermal performance varies based on the airflow (measured in Linear Feet per Minute - LFM):
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 5.31 |
| 300 (1.5 m/s) | 1.90 |
| 500 (2.5 m/s) | 1.30 |
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### 4. Part Number Breakdown (Nomenclature)
The code `ATS-08D-30-C2-R0` can be decoded as follows:
* **ATS**: Advanced Thermal Solutions.
* **08**: Specific series/designator.
* **D**: Push-pin attachment type.
* **30**: Heat sink height (25mm-30mm range identifier).
* **C2**: Thermal Interface Material (TIM) type (T766 or similar).
* **R0**: Revision or specific packaging code.
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- ⤷
What are the recommended thermal interface materials (TIM) for the ATS-08D series?
- ⤷ How do I calculate the required push-pin length for a specific PCB thickness?
- ⤷ Is there a CAD model or footprint available for PCB layout integration?