The **ATS-08D-196-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" series designed for cooling electronic components such as CPUs, GPUs, and power modules. --- ### 1. Technical Specifications The part number itself contains encoded information about its dimensions and material properties. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 10mm | | **Pitch** | Fine Pitch (High fin density) | --- ### 2. Thermal Performance Thermal resistance is the measure of how effectively the heat sink removes heat. Performance varies based on the airflow (measured in Linear Feet per Minute - LFM). | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 18.11 | | 300 (1.5 m/s) | 11.81 | | 500 (2.5 m/s) | 9.73 | | 700 (3.5 m/s) | 8.51 | --- ### 3. Key Electronic/Mechanical Features * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766**, a high-performance phase-change material that improves heat transfer between the chip and the heat sink. * **Push-Pin Attachment:** It utilizes a spring-loaded push-pin mechanism. This provides: * **Consistent Pressure:** Ensures optimal contact with the electronic component. * **Secure Fit:** Prevents the heat sink from shifting during vibration or shipping. * **Fin Design:** The "Straight Fin" or "Cross-Cut" geometry is optimized for high-density electronic boards where space is limited but high surface area is required for cooling. * **Material Properties:** The blue anodized aluminum offers both corrosion resistance and improved emissivity for better radiative cooling. --- ### 4. Common Applications * **Integrated Circuits (ICs):** Cooling high-speed processors or FPGAs. * **Power Supplies:** Managing heat in MOSFETs or voltage regulators. * **Telecommunications:** Used in networking gear like routers and switches where airflow is controlled.