The **ATS-08D-124-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) and other surface-mount components. --- ### 1. Technical Specifications The following table highlights the primary mechanical and thermal properties of this specific part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Base Dimensions** | 50.00mm x 50.00mm | | **Height** | 25.00mm | | **Thermal Resistance** | 3.28°C/W (at 100 LFM) | | **Flow Orientation** | Vertical Fin (Straight) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the product line and dimensions: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **08**: Indicates the series or specific mechanical design. * **D**: Likely refers to the specific material or attachment variant. * **124**: Represents the physical dimensions and fin configuration in the product catalog. * **C2**: Specifies the material/finish (typically Aluminum with a Blue Anodize). * **R0**: Indicates the revision or specific packaging/attachment type. --- ### 3. Key Features and Applications #### Thermal Interface Material (TIM) This heat sink typically comes pre-applied with **ATS-PPS-08** or similar thermal grease to ensure optimal heat transfer between the component (CPU/GPU/FPGA) and the aluminum base. #### Attachment System The "Push-Pin" system used in this model provides several benefits: * **Compression Springs:** Provides consistent pressure to improve thermal conductivity. * **Ease of Assembly:** Can be installed quickly without complex tools. * **Vibration Resistance:** Securely holds the heat sink in place during industrial or mobile operations. #### Common Uses * **Telecommunications:** Cooling of networking switches and routers. * **Computing:** Heat dissipation for high-speed processors and chipsets. * **Power Electronics:** Managing heat in power converters and industrial controllers. --- ### 4. Thermal Performance Comparison Thermal resistance varies based on airflow (measured in Linear Feet per Minute - LFM): ```text LFM (Velocity) | Thermal Resistance (°C/W) ------------------------------------------ 100 (0.5 m/s) | 3.28 200 (1.0 m/s) | 1.88 300 (1.5 m/s) | 1.53 400 (2.0 m/s) | 1.34 ```