The **ATS-08D-10-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, which is specifically designed to provide low thermal resistance and high reliability for cooling electronic components like CPUs, GPUs, and high-density power modules. ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Series** | maxiFLOW™ | | **Material** | Blue Anodized Aluminum | | **Thermal Resistance** | 4.75°C/W (at 200 LFM) | | **Attachment Method** | pushPIN™ (Brass pins/Stainless steel springs) | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design Components #### A. Fin Geometry (maxiFLOW™ Design) The ATS-08D-10-C2-R0 uses a **flared fin structure**. Unlike traditional straight-fin heat sinks, these fins branch outward. This design: * Increases the surface area for heat dissipation. * Allows for better airflow through the sink, even in low-velocity environments. * Reduces the pressure drop across the device. #### B. pushPIN™ Attachment System This heat sink uses a mechanical attachment system rather than adhesive tape. * **Hardware:** It consists of a brass pin and a stainless steel spring. * **Mechanism:** The pins snap into pre-drilled holes in the Printed Circuit Board (PCB). * **Benefit:** The springs provide a consistent and precise downward force (pressure) on the chip, ensuring the thermal interface material works at peak efficiency. #### C. Thermal Interface Material (TIM) The base is pre-coated with **T766 phase-change material**. * When the component heats up, the T766 softens and fills the microscopic gaps between the heat sink and the chip. * This significantly lowers the contact resistance compared to air or low-quality pads. --- ### 3. Usage Context This part is commonly found in industrial and networking equipment where airflow is managed but space is limited. * **Target Components:** Large BGA (Ball Grid Array) packages, FPGAs, and ASICs. * **Environmental Rating:** The "C2" suffix typically denotes the thermal performance grade and material finish (Blue Anodized), providing corrosion resistance and improved emissivity.