ATS-08D-05-C2-R0
AI

The **ATS-08D-05-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed by *Advanced Thermal Solutions (ATS)*, intended for cooling electronic components such as CPUs, GPUs, or high-power semiconductors.
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### 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics.
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) |
| **Series** | pushPIN™ |
| **Attachment Method** | Push-pin (Brass) |
| **Thermal Resistance** | 8.72°C/W (at 100 LFM) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 40mm x 40mm x 25mm |
| **Fin Pattern** | Fine Pitch (Straight Fin) |
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### 2. Design and Component Breakdown
#### A. The pushPIN™ Attachment System
Unlike adhesive-based heatsinks, the `C2-R0` utilizes a mechanical **push-pin** system.
- **Springs:** Stainless steel springs provide precise pressure (preload) for maximum heat transfer.
- **Pins:** Usually brass or plastic, designed to snap into pre-drilled holes in the PCB.
#### B. Thermal Interface Material (TIM)
The "C2" suffix typically indicates the type of Thermal Interface Material pre-applied to the base:
- It usually features a high-conductivity **Phase Change Material** or thermal grease to eliminate air gaps between the component and the heatsink.
#### C. Geometry and Airflow
The fins are oriented in a "Straight Fin" configuration. This is optimized for **forced air cooling** (where a fan is present). The high fin density increases the surface area for heat dissipation.
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### 3. Applications
This part is commonly found in:
* **Networking Hardware:** Routers, switches, and gateways.
* **Embedded Systems:** Industrial PCs and controllers.
* **Telecommunications:** Base station power modules.
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### 4. Thermal Performance Table
Thermal resistance varies based on the velocity of airflow (measured in Linear Feet per Minute - LFM):
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :---: |
| 100 (0.5 m/s) | 8.72 |
| 200 (1.0 m/s) | 3.00 |
| 400 (2.0 m/s) | 1.85 |
| 600 (3.0 m/s) | 1.40 |
- ⤷How do I calculate the correct hole spacing for the push-pin installation?
- ⤷ What is the difference between Blue Anodized and Black Anodized finishes in thermal terms?
- ⤷ Can this heatsink be used for natural convection cooling without a fan?