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  • ATS-08D-05-C2-R0

  • AI
    The **ATS-08D-05-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed by *Advanced Thermal Solutions (ATS)*, intended for cooling electronic components such as CPUs, GPUs, or high-power semiconductors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Attachment Method** | Push-pin (Brass) | | **Thermal Resistance** | 8.72°C/W (at 100 LFM) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Fin Pattern** | Fine Pitch (Straight Fin) | --- ### 2. Design and Component Breakdown #### A. The pushPIN™ Attachment System Unlike adhesive-based heatsinks, the `C2-R0` utilizes a mechanical **push-pin** system. - **Springs:** Stainless steel springs provide precise pressure (preload) for maximum heat transfer. - **Pins:** Usually brass or plastic, designed to snap into pre-drilled holes in the PCB. #### B. Thermal Interface Material (TIM) The "C2" suffix typically indicates the type of Thermal Interface Material pre-applied to the base: - It usually features a high-conductivity **Phase Change Material** or thermal grease to eliminate air gaps between the component and the heatsink. #### C. Geometry and Airflow The fins are oriented in a "Straight Fin" configuration. This is optimized for **forced air cooling** (where a fan is present). The high fin density increases the surface area for heat dissipation. --- ### 3. Applications This part is commonly found in: * **Networking Hardware:** Routers, switches, and gateways. * **Embedded Systems:** Industrial PCs and controllers. * **Telecommunications:** Base station power modules. --- ### 4. Thermal Performance Table Thermal resistance varies based on the velocity of airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :---: | | 100 (0.5 m/s) | 8.72 | | 200 (1.0 m/s) | 3.00 | | 400 (2.0 m/s) | 1.85 | | 600 (3.0 m/s) | 1.40 |
    ✨ Follow-up Questions
    • ⤷How do I calculate the correct hole spacing for the push-pin installation?
    • ⤷ What is the difference between Blue Anodized and Black Anodized finishes in thermal terms?
    • ⤷ Can this heatsink be used for natural convection cooling without a fan?