The **ATS-08B-87-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits that generate significant heat during operation. ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-08B-87-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 35mm x 35mm x 30mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | ~13.12 °C/W (Unducted Flow @ 100 LFM) | | **Fin Style** | Straight (Cross-Cut) | --- ### 2. Key Components & Design Features #### A. Thermal Material * **Thermal Interface Material (TIM):** This model typically comes pre-applied with **T766** high-performance thermal phase change material. This ensures maximum heat transfer between the electronic chip and the aluminum base. #### B. The pushPIN™ Attachment System Unlike adhesive tapes that can fail over time, this part uses a mechanical spring-loaded system: * **Compression Springs:** Provide precise pressure to the component, preventing damage while ensuring a tight thermal contact. * **Plastic/Brass Pins:** Inserted into pre-drilled holes in the PCB to lock the heat sink in place. #### C. Fin Geometry The "Straight" fin design is optimized for **forced air convection**. The gaps between the fins allow air from a system fan to pass through easily, carrying heat away from the aluminum core. --- ### 3. Electronic Application Use-Cases This heat sink is commonly found in the following electronic environments: * **Embedded Systems:** Industrial PCs and controllers. * **Telecommunications:** Networking switches and routers. * **Power Electronics:** Cooling MOSFETs or voltage regulators in high-density power supplies. --- ### 4. Thermal Performance Comparison Thermal resistance ($\theta$) varies based on the airflow (LFM - Linear Feet per Minute): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 13.12 | | 300 (1.5 m/s) | 4.07 | | 500 (2.5 m/s) | 2.70 |