ATS-08B-85-C2-R0
AI

The **ATS-08B-85-C2-R0** is a high-performance electronic thermal management component, specifically a **heat sink** designed by Advanced Thermal Solutions (ATS). It belongs to the "push-pin" attachment family of cooling solutions.
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### 1. Technical Specifications
The following table outlines the physical and thermal properties of the component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic) |
| **Spring Type** | Compression Spring |
| **Thermal Resistance** | 24.11°C/W (at 200 LFM) |
| **Dimensions (L x W)** | 35.00mm x 35.00mm |
| **Height** | 10.00mm |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
---
### 2. Design Characteristics
This part is engineered for compact electronic systems where space is limited but heat dissipation is critical.
* **Fin Style:** It features a **Straight Fin** design. This is ideal for systems with unidirectional airflow (forced convection), allowing air to pass through the channels with minimal pressure drop.
* **Push-Pin Mounting:** Unlike adhesive-based heat sinks, the push-pin mechanism provides a consistent and reliable mechanical pressure against the electronic component. This ensures the thermal interface material (TIM) makes optimal contact.
* **Blue Anodized Coating:** This is not just for aesthetics; the anodization protects the aluminum from corrosion and slightly increases surface emissivity for better radiation heat transfer.
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### 3. Application Use Cases
This specific heat sink is typically found on the following electronic parts:
* **Integrated Circuits (ICs):** Small to medium-sized CPUs or GPUs.
* **BGA Packages:** High-speed Ball Grid Array chips that generate significant heat.
* **Power Modules:** Voltage regulators or DC-DC converters in networking equipment.
---
### 4. Thermal Performance Comparison
Thermal resistance decreases as airflow increases. Below is a conceptual performance breakdown:
```python
# Conceptual Thermal Resistance (TR) vs Airflow (LFM)
data = {
"Unducted_Flow": "24.11 °C/W @ 200 LFM",
"Ducted_Flow": "3.80 °C/W @ 200 LFM",
"High_Velocity": "2.10 °C/W @ 800 LFM"
}
```
- ⤷
What is the hole pattern requirement for the push-pin mounting on this heat sink?
- ⤷ Can the T766 thermal interface material be replaced with a different compound?
- ⤷ How does the 'ducted' vs 'unducted' flow significantly change the cooling efficiency?