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  • ATS-08B-85-C2-R0

  • AI
    The **ATS-08B-85-C2-R0** is a high-performance electronic thermal management component, specifically a **heat sink** designed by Advanced Thermal Solutions (ATS). It belongs to the "push-pin" attachment family of cooling solutions. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 24.11°C/W (at 200 LFM) | | **Dimensions (L x W)** | 35.00mm x 35.00mm | | **Height** | 10.00mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design Characteristics This part is engineered for compact electronic systems where space is limited but heat dissipation is critical. * **Fin Style:** It features a **Straight Fin** design. This is ideal for systems with unidirectional airflow (forced convection), allowing air to pass through the channels with minimal pressure drop. * **Push-Pin Mounting:** Unlike adhesive-based heat sinks, the push-pin mechanism provides a consistent and reliable mechanical pressure against the electronic component. This ensures the thermal interface material (TIM) makes optimal contact. * **Blue Anodized Coating:** This is not just for aesthetics; the anodization protects the aluminum from corrosion and slightly increases surface emissivity for better radiation heat transfer. --- ### 3. Application Use Cases This specific heat sink is typically found on the following electronic parts: * **Integrated Circuits (ICs):** Small to medium-sized CPUs or GPUs. * **BGA Packages:** High-speed Ball Grid Array chips that generate significant heat. * **Power Modules:** Voltage regulators or DC-DC converters in networking equipment. --- ### 4. Thermal Performance Comparison Thermal resistance decreases as airflow increases. Below is a conceptual performance breakdown: ```python # Conceptual Thermal Resistance (TR) vs Airflow (LFM) data = { "Unducted_Flow": "24.11 °C/W @ 200 LFM", "Ducted_Flow": "3.80 °C/W @ 200 LFM", "High_Velocity": "2.10 °C/W @ 800 LFM" } ```
    ✨ Follow-up Questions
    • ⤷ What is the hole pattern requirement for the push-pin mounting on this heat sink?
    • ⤷ Can the T766 thermal interface material be replaced with a different compound?
    • ⤷ How does the 'ducted' vs 'unducted' flow significantly change the cooling efficiency?