The **ATS-08B-75-C1-R0** is a specific electronic component categorized as a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum (typically Blue Anodized) | | **Dimensions** | 25mm x 25mm | | **Height** | 30mm | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Thermal Resistance** | ~14.95°C/W (at 100 LFM) | | **Fin Style** | Straight Fin | --- ### 2. Physical Design & Features #### A. The Heat Sink Body * **Form Factor:** This is a square, high-profile heat sink. The 30mm height makes it suitable for cases with vertical space but small footprints. * **Fin Configuration:** It uses a straight-fin design. This is optimized for **forced air cooling** (fans) rather than passive cooling, as the fins are packed to maximize surface area. * **Material:** Made of aluminum for a balance between weight, cost, and thermal conductivity. #### B. The pushPIN™ Attachment System The "R0" at the end of the part number signifies the specific mounting hardware. * **Installation:** It uses two plastic push-pins with integrated springs. * **Benefit:** This provides consistent pressure (clamping force) on the electronic chip, ensuring better thermal transfer between the chip surface and the heat sink base. * **Hole Pattern:** Designed for specific PCB hole spacings (usually around 20mm for this size). --- ### 3. Part Number Breakdown (Nomenclature) Understanding the code helps identify the exact variant: | Code | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Brand) | | **08** | Series designation | | **B** | Aluminum material | | **75** | Specific internal dimension/style code | | **C1** | Thermal Interface Material (TIM) included (usually T766) | | **R0** | RoHS compliant / Standard hardware kit | --- ### 4. Thermal Performance Context The **ATS-08B-75-C1-R0** is highly dependent on airflow (measured in Linear Feet per Minute - LFM). * **Low Airflow:** At 100 LFM, the thermal resistance is roughly **15.0°C/W**. * **High Airflow:** At 500 LFM, the thermal resistance drops significantly to roughly **5.2°C/W**, making it much more efficient. ---