The **ATS-08B-47-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). It is part of their "pushPIN™" series, engineered for cooling integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table highlights the core technical data for this specific part number: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Plastic Pins & Springs) | | **Thermal Resistance** | 9.30°C/W (at 100 LFM) | | **Dimensions (L x W)** | 30.00 mm x 30.00 mm | | **Height** | 25.00 mm | | **Pitch** | Fine Pitch | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the component's features: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **08**: Series/Mounting style. * **B**: Material type (Aluminum). * **47**: Specific fin geometry and dimension code. * **C2**: Thermal Performance/Material Grade (High-performance aluminum). * **R0**: RoHS compliance and revision status. --- ### 3. Key Electronic/Mechanical Features #### A. pushPIN™ Attachment Unlike adhesive tapes or simple clips, the **pushPIN™** system uses a flexible, tool-less attachment mechanism. It consists of a plastic pin and a stainless steel spring that provides precise pressure (7-10 lbs) on the electronic component, ensuring optimal thermal contact without cracking the silicon die. #### B. Fin Design This model features a **cross-cut** or **straight fin** design (depending on the airflow direction). The fine-pitch arrangement is optimized for forced air environments (fans), allowing maximum heat dissipation within a compact 30mm footprint. #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. This is a phase-change or high-conductivity material that fills microscopic air gaps between the heatsink and the chip, significantly reducing thermal impedance. #### D. Blue Anodized Finish The finish is not just for aesthetics; anodizing increases the surface area at a microscopic level and protects the aluminum from oxidation, which can degrade thermal performance over time. --- ### 4. Typical Applications * **Telecommunications:** Cooling small-form-factor networking chips. * **Embedded Systems:** Industrial PCs where vertical space is limited to 25mm. * **Power Supplies:** Heat dissipation for MOSFETs or voltage regulators.