AI

The **ATS-08B-39-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series designed for securing cooling solutions to PCBs (Printed Circuit Boards).
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### 1. Technical Specifications
The following table outlines the physical and thermal properties of this specific part:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W)** | 45mm x 45mm |
| **Height** | 12.7mm |
| **Fin Style** | Straight Fin |
| **Thermal Resistance** | 13.08°C/W (at 100 LFM) |
| **Compliance** | RoHS and REACH Compliant |
---
### 2. Component Breakdown
The ATS-08B-39-C2-R0 consists of three main electronic/mechanical elements:
#### A. The Heat Sink Body
The body is constructed from **Aluminum 6063**, which offers high thermal conductivity. The "Straight Fin" design allows for low pressure drop and is optimized for airflow generated by system fans.
#### B. The Attachment Mechanism (pushPIN™)
Instead of using messy adhesives or permanent solder, this part uses a **brass or plastic push-pin** with a **stainless steel spring**. This provides:
* Consistent pressure (clamping force) for optimal heat transfer.
* Easy installation and removal for maintenance or rework.
#### C. Thermal Interface Material (TIM)
The "C2" in the part number indicates the type of Thermal Interface Material pre-applied to the base.
* **T766:** This is a high-performance thermal grease that fills microscopic air gaps between the heat sink and the electronic component (CPU, GPU, or ASIC).
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### 3. Usage Scenarios
This part is typically found in:
* **Networking Equipment:** Switches, routers, and gateways.
* **Industrial PCs:** Compact computing modules.
* **Power Supplies:** Cooling MOSFETs and voltage regulators.
---
### 4. Thermal Performance Comparison
Thermal resistance decreases as airflow (measured in Linear Feet per Minute - LFM) increases:
```python
# Comparison of Thermal Resistance (Approximate)
airflow_lfm = [100, 200, 300, 400, 500]
resistance_cw = [13.08, 5.12, 3.10, 2.31, 1.91]
for flow, res in zip(airflow_lfm, resistance_cw):
print(f"Airflow: {flow} LFM | Thermal Resistance: {res} °C/W")
```
- ⤷How does the pushPIN mounting system compare to adhesive tapes?
- ⤷ What are the dimensions of the mounting holes required for this heat sink?
- ⤷ Can this heat sink be used with high-power GPUs?