ATS-08B-29-C2-R0
AI

The **ATS-08B-29-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling integrated circuits (ICs) like processors, FPGAs, and ASICs.
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### 1. Technical Specifications
The following table highlights the core physical and thermal properties of this specific model:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (Al) |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 45mm x 45mm x 20mm |
| **Fin Type** | Straight Fin |
| **Attachment Type** | Push Pin (Plastic/Brass) |
| **Thermal Resistance** | 7.57 °C/W (at 200 LFM) |
| **Spring Type** | Compression Spring |
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### 2. Key Components & Design Features
#### A. The Heat Sink Body
The body is made of extruded aluminum. Aluminum is chosen for its excellent thermal conductivity-to-weight ratio. The **Blue Anodized** finish is not just for aesthetics; it provides surface protection against corrosion and slightly increases emissivity for better radiative cooling.
#### B. Attachment Mechanism (Push Pins)
Instead of using messy thermal adhesives or tape, this part uses a **Push Pin** system:
* **Mechanical Stability:** Two pins go through pre-drilled holes in the PCB.
* **Pressure:** Built-in springs ensure consistent downward pressure, which is critical for maximizing the efficiency of the Thermal Interface Material (TIM).
#### C. Straight Fin Geometry
The "Straight Fin" design is optimized for **forced air cooling**. This means it performs best when there is a fan or directed airflow moving through the fins. The gaps between the fins allow heat to be carried away by convection.
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### 3. Thermal Performance Metrics
Thermal resistance indicates how effectively the part moves heat away from the electronics.
* **Low Airflow (200 LFM):** ~7.57 °C/W
* **High Airflow (500 LFM):** ~3.24 °C/W
*Note: The lower the °C/W value, the better the cooling performance.*
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### 4. Common Applications
This part is typically found in:
1. **Networking Hardware:** Routers, switches, and high-speed modems.
2. **Power Supplies:** Cooling MOSFETs or voltage regulators.
3. **Industrial PCs:** Compact motherboards where space is limited.
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What are the benefits of push pin mounting over thermal adhesive?
- ⤷ How does 'LFM' airflow affect the choice of this heat sink?
- ⤷ Are there alternative finishes to blue anodized for different environments?