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  • ATS-08B-29-C2-R0

  • AI
    The **ATS-08B-29-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling integrated circuits (ICs) like processors, FPGAs, and ASICs. --- ### 1. Technical Specifications The following table highlights the core physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | | **Fin Type** | Straight Fin | | **Attachment Type** | Push Pin (Plastic/Brass) | | **Thermal Resistance** | 7.57 °C/W (at 200 LFM) | | **Spring Type** | Compression Spring | --- ### 2. Key Components & Design Features #### A. The Heat Sink Body The body is made of extruded aluminum. Aluminum is chosen for its excellent thermal conductivity-to-weight ratio. The **Blue Anodized** finish is not just for aesthetics; it provides surface protection against corrosion and slightly increases emissivity for better radiative cooling. #### B. Attachment Mechanism (Push Pins) Instead of using messy thermal adhesives or tape, this part uses a **Push Pin** system: * **Mechanical Stability:** Two pins go through pre-drilled holes in the PCB. * **Pressure:** Built-in springs ensure consistent downward pressure, which is critical for maximizing the efficiency of the Thermal Interface Material (TIM). #### C. Straight Fin Geometry The "Straight Fin" design is optimized for **forced air cooling**. This means it performs best when there is a fan or directed airflow moving through the fins. The gaps between the fins allow heat to be carried away by convection. --- ### 3. Thermal Performance Metrics Thermal resistance indicates how effectively the part moves heat away from the electronics. * **Low Airflow (200 LFM):** ~7.57 °C/W * **High Airflow (500 LFM):** ~3.24 °C/W *Note: The lower the °C/W value, the better the cooling performance.* --- ### 4. Common Applications This part is typically found in: 1. **Networking Hardware:** Routers, switches, and high-speed modems. 2. **Power Supplies:** Cooling MOSFETs or voltage regulators. 3. **Industrial PCs:** Compact motherboards where space is limited.
    ✨ Follow-up Questions
    • ⤷ What are the benefits of push pin mounting over thermal adhesive?
    • ⤷ How does 'LFM' airflow affect the choice of this heat sink?
    • ⤷ Are there alternative finishes to blue anodized for different environments?