ATS-08B-19-C2-R0
AI

The **ATS-08B-19-C2-R0** is a specific part number for a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. This component is part of their "push-pin" thermal management series designed for cooling electronic components like CPUs, GPUs, and FPGAs.
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### 1. Technical Specifications
The part number identifies the specific physical dimensions and thermal properties of the heat sink.
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 9.77°C/W (at 200 LFM) |
| **Dimensions (L x W)** | 35mm x 35mm |
| **Height** | 20mm |
| **Attachment Method** | Push-Pin (Brass) |
| **Spring Type** | Compression Spring |
| **Interface Material** | T766 (Thermal Tape/Grease pre-applied) |
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### 2. Physical Design Features
* **Fin Pattern:** This model features a **cross-cut** or "straight fin" design. This allows for multi-directional airflow, making it more efficient in systems where air might not flow in a perfectly straight line.
* **Blue Anodization:** The blue coating is not just for aesthetics; it provides surface protection and slightly increases emissivity to help with heat radiation.
* **Push-Pin Attachment:** It uses a mechanical attachment system consisting of two plastic or brass pins and springs. This ensures a consistent downward force (pressure) onto the electronic chip for optimal heat transfer.
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### 3. Electronic Application
The ATS-08B-19-C2-R0 is typically used for cooling:
1. **Application Specific Integrated Circuits (ASICs):** Custom chips in networking hardware.
2. **Logic Components:** High-speed processors that generate localized heat.
3. **Power Electronics:** Components that require steady-state temperature control to prevent "thermal runaway."
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### 4. Thermal Performance Comparison
The effectiveness of this part depends heavily on the **Linear Feet per Minute (LFM)** of the airflow provided by the system's fans:
| Airflow (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (Natural) | 13.00 |
| 200 (Low Flow) | 9.77 |
| 400 (Moderate) | 6.80 |
| 600 (High Flow) | 5.50 |
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How do I calculate if this heat sink is sufficient for a 10W chip?
- ⤷ What is the specific hole pattern required on the PCB for these push-pins?
- ⤷ Are there alternative interface materials (TIM) available for this model?