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  • ATS-08B-19-C2-R0

  • AI
    The **ATS-08B-19-C2-R0** is a specific part number for a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. This component is part of their "push-pin" thermal management series designed for cooling electronic components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications The part number identifies the specific physical dimensions and thermal properties of the heat sink. | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 9.77°C/W (at 200 LFM) | | **Dimensions (L x W)** | 35mm x 35mm | | **Height** | 20mm | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Interface Material** | T766 (Thermal Tape/Grease pre-applied) | --- ### 2. Physical Design Features * **Fin Pattern:** This model features a **cross-cut** or "straight fin" design. This allows for multi-directional airflow, making it more efficient in systems where air might not flow in a perfectly straight line. * **Blue Anodization:** The blue coating is not just for aesthetics; it provides surface protection and slightly increases emissivity to help with heat radiation. * **Push-Pin Attachment:** It uses a mechanical attachment system consisting of two plastic or brass pins and springs. This ensures a consistent downward force (pressure) onto the electronic chip for optimal heat transfer. --- ### 3. Electronic Application The ATS-08B-19-C2-R0 is typically used for cooling: 1. **Application Specific Integrated Circuits (ASICs):** Custom chips in networking hardware. 2. **Logic Components:** High-speed processors that generate localized heat. 3. **Power Electronics:** Components that require steady-state temperature control to prevent "thermal runaway." --- ### 4. Thermal Performance Comparison The effectiveness of this part depends heavily on the **Linear Feet per Minute (LFM)** of the airflow provided by the system's fans: | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural) | 13.00 | | 200 (Low Flow) | 9.77 | | 400 (Moderate) | 6.80 | | 600 (High Flow) | 5.50 |
    ✨ Follow-up Questions
    • ⤷ How do I calculate if this heat sink is sufficient for a 10W chip?
    • ⤷ What is the specific hole pattern required on the PCB for these push-pins?
    • ⤷ Are there alternative interface materials (TIM) available for this model?