The **ATS-08B-166-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed specifically for cooling electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS. Below are the physical and thermal characteristics: | Property | Value | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Thermal Resistance** | 12.30°C/W (Unducted Flow @ 200 LFM) | | **Dimensions (L x W x H)** | 25mm x 25mm x 15mm | | **Fin Style** | Square Pin Fin | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### 2. Breakdown of the Part Number To understand the electronic application, we can decode the identifier: - **ATS-08**: Refers to the specific series of high-efficiency pin-fin heat sinks. - **B**: Indicates the attachment mechanism (Push-pin style). - **166**: Specific size and height configuration (25mm x 15mm). - **C3**: Refers to the material and finish (Blue Anodized Aluminum). - **R0**: Revision/Packaging code. --- ### 3. Key Electronic Features #### A. Pin Fin Design Unlike traditional straight-fin heat sinks, the **Square Pin Fin** design allows for multidirectional airflow. This is critical in crowded PCB environments where air might not be moving in a single linear path. It increases the surface area for heat dissipation while creating turbulence to improve cooling efficiency. #### B. Push Pin Attachment This part uses a spring-loaded push-pin mechanism. In electronics, this is preferred over adhesive tapes for: * **Constant Pressure:** Ensures the heat sink stays flat against the chip. * **Reliability:** Better vibration resistance compared to thermal tape. * **Reusability:** Easier to remove for chip maintenance or inspection. #### C. Thermal Interface Material (T412) The part comes with **T412** pre-applied. This is a high-performance phase-change material or thermal pad that fills microscopic air gaps between the component surface and the heat sink, significantly lowering thermal impedance. --- ### 4. Common Applications This specific size (25mm x 25mm) is commonly used for: * **Northbridge/Southbridge** chipsets on motherboards. * **FPGA** (Field Programmable Gate Arrays). * **Network processors** in switches and routers. * **LED** power modules.