ATS-08B-154-C2-R0
AI

The **ATS-08B-154-C2-R0** is a specific model of a high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. It is part of their "push pin" attachment series, designed for cooling electronic components like CPUs, GPUs, or high-power transistors.
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### 1. Technical Specifications
The following table highlights the core physical and thermal properties of this component:
| Feature | Specification |
|:---|:---|
| **Manufacturer** | Advanced Thermal Solutions, Inc. |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Spring Loaded) |
| **Thermal Resistance** | 7.51°C/W (at 200 LFM) |
| **Dimensions (L x W x H)** | 40mm x 40mm x 15mm |
| **Fin Type** | XCUT (Cross-Cut) |
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### 2. Key Electronic Features
The ATS-08B-154-C2-R0 is engineered to optimize thermal management in crowded PCB environments:
* **XCUT Fin Pattern:** Unlike straight fins, the cross-cut design allows for airflow from multiple directions. This is critical in electronic enclosures where the fan placement might not be perfectly aligned with the heat sink.
* **Push-Pin Attachment:** It utilizes a brass push-pin mechanism with a built-in compression spring. This ensures a consistent "downward force" on the electronic chip, which improves the contact between the chip surface and the heat sink.
* **Thermal Interface Material (TIM):** This model typically comes pre-applied with **T766**, a high-performance phase-change thermal pad. This eliminates the need for manual thermal paste application.
* **Material Science:** Made from 6063 aluminum, it provides a balance between high thermal conductivity and lightweight properties to prevent mechanical stress on the PCB.
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### 3. Usage Scenarios
This component is generally used for:
1. **BGA Cooling:** Protecting Ball Grid Array (BGA) chips from overheating.
2. **Power Electronics:** Cooling MOSFETs or Voltage Regulators (VRMs).
3. **Industrial Computing:** Used in fan-cooled or passively cooled embedded systems.
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### 4. Part Number Breakdown
The SKU `ATS-08B-154-C2-R0` follows a specific logic:
| Segment | Meaning |
|:---|:---|
| **ATS** | Manufacturer Prefix (Advanced Thermal Solutions) |
| **08B** | Series/Product Family (Push-pin style) |
| **154** | Specific dimensional code (40x40x15mm) |
| **C2** | Thermal Performance/Material grade |
| **R0** | Revision or RoHS Compliance indicator |
- ⤷What is the difference between XCUT and straight fin heat sinks?
- ⤷ How do I calculate if the 7.51°C/W thermal resistance is sufficient for my chip?
- ⤷ What are the mounting hole diameter requirements for the push-pins?