The **ATS-08B-147-C2-R0** is a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "pushPIN™" series, designed for the thermal management of electronic components such as CPUs, GPUs, and other high-heat integrated circuits. --- ## 1. Technical Specifications The following table highlights the critical mechanical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 13.52 °C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 10.00mm | | **Fin Style** | Straight Fin | | **Pattern** | 4-Corner Attachment | --- ## 2. Key Components & Design Features ### A. Thermal Interface Material (TIM) The "R0" suffix indicates that the part comes pre-applied with **Advanced Thermal Solutions' T766 phase change material**. This ensures optimal heat transfer between the electronic component and the aluminum sink without requiring manual application of thermal paste. ### B. pushPIN™ Attachment System Instead of using messy adhesives or simple clips, this model uses a specialized push-pin system: * **Flexible Springs:** Provide precise pressure to maintain contact. * **Brass/Plastic Pins:** Secure the sink to the PCB through pre-drilled holes. ### C. Fin Geometry The **straight-fin design** is optimized for **forced air cooling** (active airflow from a fan). The low profile (10mm height) makes it ideal for dense electronic assemblies where vertical space is limited. --- ## 3. Thermal Performance Metrics The effectiveness of this heat sink depends on the airflow (Measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (0.5 m/s)** | 13.52 | | **300 (1.5 m/s)** | 7.53 | | **500 (2.5 m/s)** | 5.81 | | **700 (3.5 m/s)** | 5.05 | --- ## 4. Application Summary * **Target Components:** BGA (Ball Grid Array) chips, power transistors, and small processors. * **Environment:** High-density telecommunications, networking hardware, and industrial computing.