The **ATS-08B-07-C2-R0** is a specific electronic component primarily classified as a **High-Performance Heat Sink**. It is manufactured by *Advanced Thermal Solutions (ATS)* and belongs to their push-pin mounted series designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-08B-07-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | Approx. 16.97°C/W (at 200 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Physical Dimensions The physical footprint is critical for PCB layout and clearance. * **Length:** 45.00 mm * **Width:** 45.00 mm * **Height:** 12.70 mm * **Pitch:** Specific hole spacing for push-pin mounting. --- ### 3. Key Electronic Cooling Features #### A. Fin Design The "ATS-08" series utilizes **Straight Fin** geometry. This design is optimized for environments where there is a consistent, directional airflow. The gaps between the fins allow for low-pressure drops while maximizing surface area for heat dissipation. #### B. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied. This is a "Phase Change" material that softens at operating temperatures to fill microscopic air gaps between the heat sink and the electronic component, ensuring maximum heat transfer efficiency. #### C. Push-Pin Attachment Instead of using messy adhesives or thermal tape, this part uses a **Push-Pin and Compression Spring** mechanism. * **Reliability:** Provides consistent downward pressure. * **Serviceability:** Allows the heat sink to be removed and re-installed easily compared to permanent epoxies. --- ### 4. Typical Applications * **Integrated Circuits (ICs):** Cooling FPGAs or ASICs. * **Power Electronics:** Voltage regulators and power modules. * **Networking Hardware:** Routers and switches where high-speed processing generates significant heat.