The **ATS-08B-06-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series and is designed for electronic components requiring efficient thermal management, such as CPUs, GPUs, or high-power ASICs. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-08B-06-C2-R0 | | **Material** | Aluminum (with Blue Anodized finish) | | **Thermal Resistance** | 20.12°C/W (Unducted Flow @ 100 LFM) | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Fin Style** | Straight Fin | | **Interface Material** | T766 (Thermal Interface Material pre-applied) | --- ### Core Electronic Components & Features #### 1. Thermal Management Logic The primary purpose of this part is to dissipate heat from integrated circuits. The **straight fin design** is optimized for high-density airflow environments, ensuring that the junction temperature ($T_j$) of the electronic component remains within safe operating limits. #### 2. pushPIN™ Attachment Mechanism Unlike traditional adhesive-based heat sinks, this model uses a mechanical mounting system: * **Spring-loaded bolts:** Provide consistent pressure across the component surface, improving thermal conductivity. * **Compression Springs:** These are engineered to provide specific "force" ratings to prevent damage to delicate silicon dies while ensuring no air gaps exist. #### 3. Thermal Interface Material (TIM) The part comes pre-applied with **T766**. This is a high-performance phase-change material or grease that fills microscopic air gaps between the component's heat spreader and the heat sink base, significantly reducing thermal resistance. #### 4. Material Science * **Aluminum 6063:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodized Finish:** Provides a protective layer against corrosion and slightly increases emissivity for better radiative cooling. --- ### Thermal Performance Data (Airflow) | Velocity (LFM) | 100 (0.5m/s) | 300 (1.5m/s) | 500 (2.5m/s) | 700 (3.5m/s) | | :--- | :--- | :--- | :--- | :--- | | **Unducted (°C/W)** | 20.12 | 8.09 | 4.88 | 3.62 | | **Ducted (°C/W)** | 5.38 | 3.49 | 2.85 | 2.48 |