The **ATS-07H-89-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** series of high-performance heat sinks designed for cooling integrated circuits (ICs), such as CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Feature | Specification | |:---|:---| | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 35.00 mm x 35.00 mm | | **Height** | 20.00 mm | | **Pitch** | Fine Pitch | | **Pattern** | Straight Fin | --- ### 2. Physical Design Components * **Heat Sink Body:** A square aluminum block with vertical fins. The straight-fin design is optimized for environments where there is a consistent, directional airflow. * **Push-Pins:** These are the mechanical fasteners (usually plastic or brass) that secure the heat sink to the PCB. They eliminate the need for adhesive tapes. * **Compression Springs:** These provide a precise "clamping force" to ensure the base of the heat sink maintains firm contact with the electronic chip. * **Thermal Interface Material (TIM):** This part usually comes with pre-applied **T766** thermal phase change material or grease on the base to bridge the microscopic air gaps between the chip and the metal. --- ### 3. Performance Factors The efficiency of the ATS-07H-89-C2-R0 is measured by its **Thermal Resistance**. Lower values indicate better cooling. | Airflow Velocity | Thermal Resistance (Unducted) | |:---|:---| | @ 100 LFM (0.5 m/s) | ~7.94 °C/W | | @ 400 LFM (2.0 m/s) | ~2.10 °C/W | | @ 700 LFM (3.5 m/s) | ~1.40 °C/W | --- ### 4. Component Application This part is typically used in: 1. **Telecommunications:** Cooling network switches and routers. 2. **Embedded Systems:** Industrial PCs where space is limited but high heat dissipation is required. 3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators.