The **ATS-07H-85-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ## 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Base Series** | pushPIN™ HS | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 10.00mm | | **Fin Style** | Fine-Pitch (Straight Fins) | | **Thermal Resistance** | 23.98°C/W (Unducted Flow @ 100 LFM) | --- ## 2. Key Component Features ### A. Push-Pin Mounting System This model uses a **push-pin** mechanism with a brass or plastic pin and a high-performance compression spring. * **Advantage:** Provides consistent pressure across the interface (TIM), ensuring optimal heat transfer. * **Installation:** Requires pre-drilled holes on the PCB (Printed Circuit Board). ### B. Material and Finish * **Aluminum Construction:** Offers a balance between lightweight design and high thermal conductivity. * **Blue Anodized Coating:** This is not just for aesthetics; the anodized layer provides corrosion resistance and increases surface emissivity, which slightly improves radiant heat transfer. ### C. Thermal Interface Material (TIM) The "R0" at the end of the part number typically signifies that the heat sink comes with a **pre-applied thermal interface material** (usually a Phase Change Material or high-performance grease). This ensures there are no air gaps between the component and the heat sink. --- ## 3. Performance Data (Airflow) Thermal resistance varies based on the velocity of the air moving through the fins: | Velocity (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 23.98 | | 200 | 1.0 | 12.89 | | 300 | 1.5 | 9.07 | | 400 | 2.0 | 7.30 | | 500 | 2.5 | 6.31 | --- ### Summary of Use This part is ideal for **low-profile applications** where vertical space is limited (only 10mm high) but effective cooling is required for medium-power chips.