The **ATS-07H-83-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** Heat Sink series, designed for thermal management of integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The following table highlights the core physical and thermal properties of this part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 30.00mm | | **Pitch** | Fine-Pitch | | **Thermal Resistance (Unducted)** | 1.60 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 0.97 °C/W @ 100 LFM | --- ### 2. Key Components & Features #### A. Thermal Interface Material (TIM) * This part typically comes pre-applied with **T766** thermal phase change material. * **Purpose:** To fill microscopic air gaps between the heat source (CPU/GPU/Transistor) and the aluminum base to maximize heat transfer. #### B. The pushPIN™ Attachment System Instead of using messy adhesives or permanent solder, this part uses a mechanical fastening system: 1. **Springs:** Provides consistent pressure to ensure optimal contact with the chip. 2. **Hardware:** Available in brass or plastic pins. 3. **Hole Pattern:** Requires specific PCB hole spacing (typically 35mm x 35mm for this model) to secure the sink. #### C. Fin Design The "83" in the part number refers to a specific fin geometry. These are designed for **high-performance airflow** environments. The fine-pitch fins increase the surface area, allowing air to carry away heat more efficiently. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying variants: * **ATS:** Advanced Thermal Solutions (Manufacturer) * **07H:** Series/Family type * **83:** Specific Fin/Geometry profile * **C2:** Thermal Interface Material / Performance grade * **R0:** Revision code --- ### 4. Applications * **Networking Gear:** Switches and routers where high-speed processors generate significant heat. * **Embedded Systems:** Industrial PCs or IoT gateways. * **Power Electronics:** Cooling MOSFETs or power regulators.