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  • ATS-07H-77-C2-R0

  • AI
    The **ATS-07H-77-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" family, designed for high-density electronic cooling applications. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-07H-77-C2-R0 | | **Heat Sink Type** | Push-Pin (Aluminium) | | **Fin Style** | Straight (Fine Pitch) | | **Attachment Method** | Push-Pin with Springs | | **Material / Finish** | Aluminum / Blue Anodized | | **Thermal Resistance** | 9.30°C/W (at 100 LFM) | --- ### 2. Physical Dimensions The physical footprint is crucial for determining if the part fits on a PCB (Printed Circuit Board) without interfering with other surface-mount components. * **Length (A):** 25.00 mm * **Width (B):** 25.00 mm * **Height (C):** 20.00 mm * **Pitch (E):** 30.00 mm (Distance between mounting holes) * **Pitch (F):** 30.00 mm --- ### 3. Key Electronic Functions While the heat sink itself does not carry electrical signals, it is critical for the **thermal management** of electronic components: 1. **Heat Dissipation:** It increases the surface area of high-heat components (like CPUs, MOSFETs, or FPGAs) to facilitate faster cooling via convection. 2. **Overheat Protection:** By maintaining lower junction temperatures, it prevents "thermal throttling" and extends the lifespan of the underlying semiconductor. 3. **EMI Shielding:** In some configurations, the grounded metal body can assist in reducing electromagnetic interference (EMI). --- ### 4. Part Number Breakdown The suffixing in the part number provides details about the material and mounting: * **-C2:** Indicates the thermal interface material (TIM) applied. In this case, it usually refers to **T766** (a high-performance thermal grease). * **-R0:** Indicates the revision and standard packaging/color (Blue Anodized). --- ### 5. Implementation Example To use this in a hardware design, a designer would reference the mounting hole pattern in their EDA software (like Altium or KiCad): ```cpp // Typical mounting hole requirement for ATS-07H-77-C2-R0 Mounting_Hole_Diameter = 3.175mm; // Standard for ATS Push-pins Hole_Spacing_X = 30.0mm; Hole_Spacing_Y = 30.0mm; ``` ---
    ✨ Follow-up Questions
    • ⤷What is the difference between push-pin and adhesive mounting for this heat sink?
    • ⤷ How does the air flow rate (LFM) affect the thermal resistance of the ATS-07H-77-C2-R0?
    • ⤷ Is this heat sink suitable for a TO-220 package or specialized for BGAs?