ATS-07H-77-C2-R0
AI

The **ATS-07H-77-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" family, designed for high-density electronic cooling applications.
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### 1. Technical Specifications
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) |
| **Part Number** | ATS-07H-77-C2-R0 |
| **Heat Sink Type** | Push-Pin (Aluminium) |
| **Fin Style** | Straight (Fine Pitch) |
| **Attachment Method** | Push-Pin with Springs |
| **Material / Finish** | Aluminum / Blue Anodized |
| **Thermal Resistance** | 9.30°C/W (at 100 LFM) |
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### 2. Physical Dimensions
The physical footprint is crucial for determining if the part fits on a PCB (Printed Circuit Board) without interfering with other surface-mount components.
* **Length (A):** 25.00 mm
* **Width (B):** 25.00 mm
* **Height (C):** 20.00 mm
* **Pitch (E):** 30.00 mm (Distance between mounting holes)
* **Pitch (F):** 30.00 mm
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### 3. Key Electronic Functions
While the heat sink itself does not carry electrical signals, it is critical for the **thermal management** of electronic components:
1. **Heat Dissipation:** It increases the surface area of high-heat components (like CPUs, MOSFETs, or FPGAs) to facilitate faster cooling via convection.
2. **Overheat Protection:** By maintaining lower junction temperatures, it prevents "thermal throttling" and extends the lifespan of the underlying semiconductor.
3. **EMI Shielding:** In some configurations, the grounded metal body can assist in reducing electromagnetic interference (EMI).
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### 4. Part Number Breakdown
The suffixing in the part number provides details about the material and mounting:
* **-C2:** Indicates the thermal interface material (TIM) applied. In this case, it usually refers to **T766** (a high-performance thermal grease).
* **-R0:** Indicates the revision and standard packaging/color (Blue Anodized).
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### 5. Implementation Example
To use this in a hardware design, a designer would reference the mounting hole pattern in their EDA software (like Altium or KiCad):
```cpp
// Typical mounting hole requirement for ATS-07H-77-C2-R0
Mounting_Hole_Diameter = 3.175mm; // Standard for ATS Push-pins
Hole_Spacing_X = 30.0mm;
Hole_Spacing_Y = 30.0mm;
```
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- ⤷What is the difference between push-pin and adhesive mounting for this heat sink?
- ⤷ How does the air flow rate (LFM) affect the thermal resistance of the ATS-07H-77-C2-R0?
- ⤷ Is this heat sink suitable for a TO-220 package or specialized for BGAs?