ATS-07H-72-C2-R0
AI

The **ATS-07H-72-C2-R0** is a specific part number for a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" attachment series designed to cool electronic components like CPUs, GPUs, or high-power transistors.
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### 1. Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (Al) |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 5.11°C/W @ 100 LFM |
| **Dimensions (L x W)** | 45.00mm x 45.00mm |
| **Height** | 15.00mm |
| **Fin Pattern** | Straight |
| **Attachment Type** | Push-Pin (Plastic/Brass) |
| **Thermal Interface Material** | T766 (Pre-applied) |
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### 2. Physical Design Features
* **Fin Style:** This model uses a **straight-fin** design. Straight fins are ideal for high-velocity airflows where the air can move through the channels with minimal resistance.
* **Push-Pin Attachment:** Instead of messy adhesives or heavy brackets, it uses two spring-loaded push-pins. This provides constant pressure (7-10 lbs) for optimal thermal contact and allows for easy removal/rework.
* **Material:** The aluminum construction offers a balance between lightweight design and efficient heat dissipation. The **Blue Anodized** coating protects against corrosion and improves radiative cooling.
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### 3. Thermal Performance Profile
Thermal resistance measures how effectively the part moves heat away from the chip. Lower values indicate better performance.
| Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) |
| :--- | :--- | :--- |
| 100 | 0.5 | 5.11 |
| 200 | 1.0 | 3.56 |
| 400 | 2.0 | 2.62 |
| 600 | 3.0 | 2.11 |
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### 4. Integration Considerations
* **PCB Hole Pattern:** This heat sink requires specific pre-drilled holes in the Printed Circuit Board (PCB) to accommodate the push-pins.
* **Component Size:** It is optimized for components with a footprint close to 45mm x 45mm.
* **Height Clearance:** With a height of 15mm, it is suitable for 1U or 2U rack-mounted chassis and low-profile electronic enclosures.
- ⤷
What are the PCB hole diameter requirements for the ATS push-pin system?
- ⤷ How does the T766 thermal interface material compare to standard thermal paste?
- ⤷ Are there copper versions of this heat sink for higher power density applications?