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  • ATS-07H-72-C2-R0

  • AI
    The **ATS-07H-72-C2-R0** is a specific part number for a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" attachment series designed to cool electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 5.11°C/W @ 100 LFM | | **Dimensions (L x W)** | 45.00mm x 45.00mm | | **Height** | 15.00mm | | **Fin Pattern** | Straight | | **Attachment Type** | Push-Pin (Plastic/Brass) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Physical Design Features * **Fin Style:** This model uses a **straight-fin** design. Straight fins are ideal for high-velocity airflows where the air can move through the channels with minimal resistance. * **Push-Pin Attachment:** Instead of messy adhesives or heavy brackets, it uses two spring-loaded push-pins. This provides constant pressure (7-10 lbs) for optimal thermal contact and allows for easy removal/rework. * **Material:** The aluminum construction offers a balance between lightweight design and efficient heat dissipation. The **Blue Anodized** coating protects against corrosion and improves radiative cooling. --- ### 3. Thermal Performance Profile Thermal resistance measures how effectively the part moves heat away from the chip. Lower values indicate better performance. | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 5.11 | | 200 | 1.0 | 3.56 | | 400 | 2.0 | 2.62 | | 600 | 3.0 | 2.11 | --- ### 4. Integration Considerations * **PCB Hole Pattern:** This heat sink requires specific pre-drilled holes in the Printed Circuit Board (PCB) to accommodate the push-pins. * **Component Size:** It is optimized for components with a footprint close to 45mm x 45mm. * **Height Clearance:** With a height of 15mm, it is suitable for 1U or 2U rack-mounted chassis and low-profile electronic enclosures.
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole diameter requirements for the ATS push-pin system?
    • ⤷ How does the T766 thermal interface material compare to standard thermal paste?
    • ⤷ Are there copper versions of this heat sink for higher power density applications?