ATS-07H-69-C2-R0
AI

The **ATS-07H-69-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** Heat Sink series.
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## 1. Technical Specifications
This component is an active/passive thermal management solution designed for cooling integrated circuits (ICs) and other electronic components.
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Base Dimensions** | 45mm x 45mm |
| **Height** | 20mm |
| **Attachment Type** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 11.31°C/W (Unducted @ 100 LFM) |
| **Thermal Interface Material** | T766 (High Performance) |
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## 2. Key Design Elements
### A. Fin Geometry
The "69" in the part number indicates the specific fin pattern. This model typically features a **straight-fin design**, which allows for efficient airflow across the surface area to dissipate heat away from the PCB.
### B. pushPIN™ Attachment Mechanism
Unlike adhesive-based heat sinks, this part uses a mechanical attachment system:
* **Compression Springs:** Provide a precise amount of force to ensure consistent contact with the heat source.
* **Plastic/Brass Push Pins:** Snap into pre-drilled holes in the PCB for a secure fit that resists vibration.
### C. Thermal Interface Material (TIM)
The part comes pre-applied with **T766 thermal grease**. This eliminates the need for manual application and ensures there are no air gaps between the component (like a CPU or FPGA) and the aluminum base of the heat sink.
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## 3. Physical Dimensions (Metric)
| Dimension | Value (mm) |
| :--- | :--- |
| Width (A) | 45.00 |
| Length (B) | 45.00 |
| Height (C) | 20.00 |
| Pitch (E) | 38.00 |
| Pitch (F) | 38.00 |
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## 4. Typical Applications
* **Networking Equipment:** High-speed routers and switches.
* **Power Supplies:** Cooling MOSFETs or voltage regulators.
* **Industrial PCs:** Ensuring thermal stability in embedded systems.
* **FPGAs/ASICs:** Managing heat in programmable logic devices.
- ⤷
How does the thermal resistance of this model change with higher airflow (LFM)?
- ⤷ What are the PCB hole diameter requirements for the pushPIN attachment?
- ⤷ Are there alternative finish options for this specific heat sink model?