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  • ATS-07H-69-C2-R0

  • AI
    The **ATS-07H-69-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** Heat Sink series. --- ## 1. Technical Specifications This component is an active/passive thermal management solution designed for cooling integrated circuits (ICs) and other electronic components. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Base Dimensions** | 45mm x 45mm | | **Height** | 20mm | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 11.31°C/W (Unducted @ 100 LFM) | | **Thermal Interface Material** | T766 (High Performance) | --- ## 2. Key Design Elements ### A. Fin Geometry The "69" in the part number indicates the specific fin pattern. This model typically features a **straight-fin design**, which allows for efficient airflow across the surface area to dissipate heat away from the PCB. ### B. pushPIN™ Attachment Mechanism Unlike adhesive-based heat sinks, this part uses a mechanical attachment system: * **Compression Springs:** Provide a precise amount of force to ensure consistent contact with the heat source. * **Plastic/Brass Push Pins:** Snap into pre-drilled holes in the PCB for a secure fit that resists vibration. ### C. Thermal Interface Material (TIM) The part comes pre-applied with **T766 thermal grease**. This eliminates the need for manual application and ensures there are no air gaps between the component (like a CPU or FPGA) and the aluminum base of the heat sink. --- ## 3. Physical Dimensions (Metric) | Dimension | Value (mm) | | :--- | :--- | | Width (A) | 45.00 | | Length (B) | 45.00 | | Height (C) | 20.00 | | Pitch (E) | 38.00 | | Pitch (F) | 38.00 | --- ## 4. Typical Applications * **Networking Equipment:** High-speed routers and switches. * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **Industrial PCs:** Ensuring thermal stability in embedded systems. * **FPGAs/ASICs:** Managing heat in programmable logic devices.
    ✨ Follow-up Questions
    • ⤷ How does the thermal resistance of this model change with higher airflow (LFM)?
    • ⤷ What are the PCB hole diameter requirements for the pushPIN attachment?
    • ⤷ Are there alternative finish options for this specific heat sink model?