The **ATS-07H-64-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by Advanced Thermal Solutions (ATS). It belongs to their "pushPIN™" series, designed for efficient cooling of localized heat sources like ICs, CPUs, and GPUs. --- ### 1. Technical Specifications The following table summarizes the physical and thermal properties of the part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 45.00 mm x 45.00 mm | | **Height** | 25.00 mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 9.39 °C/W (at 100 LFM) | | **Fin Style** | XC (Cross-Cut) | | **Spring/Hardware** | ATS-PP-08 / Brass | --- ### 2. Key Component Features #### A. XC (Cross-Cut) Fin Design Unlike straight-fin heatsinks, the cross-cut design allows for multidirectional airflow. This makes it ideal for dense PCB layouts where the direction of the cooling fan's airflow might not be perfectly aligned with the heatsink. #### B. pushPIN™ Attachment System This part uses a specific mounting mechanism: * **Ease of Assembly:** It utilizes a push-pin and spring mechanism for quick installation. * **Constant Pressure:** The spring ensures that the heatsink maintains consistent contact pressure with the component, maximizing heat transfer. * **Reliability:** It is more secure than thermal adhesive tapes and can withstand higher vibration environments. #### C. C2 Thermal Interface Material (TIM) The "C2" suffix indicates that the heatsink comes pre-applied with a **T766 Phase Change Material**. This high-performance thermal grease/pad fills microscopic air gaps between the heatsink and the chip, significantly lowering thermal resistance. --- ### 3. Thermal Performance Analysis The efficiency of this heatsink depends on the Airflow (Measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 9.39 | | 300 | 1.5 | 2.50 | | 500 | 2.5 | 1.58 | | 700 | 3.5 | 1.25 | --- ### 4. Typical Applications * **Processors:** Cooling of FPGAs, ASICs, or Embedded CPUs. * **Telecommunications:** Networking switches and routers. * **Industrial Electronics:** Power supply modules and high-heat motor controllers.