The **ATS-07H-142-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "blueICE" series, specifically designed for cooling electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ## Technical Specifications The following table outlines the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | push-PIN™ | | **Thermal Resistance (Flow)** | 7.22°C/W @ 100 LFM | | **Thermal Resistance (Static)** | 4.51°C/W @ 200 LFM | | **Dimensions (L x W)** | 30.00 mm x 30.00 mm | | **Height** | 15.00 mm | | **Pin Pitch** | 35.00 mm | --- ## Key Design Components ### 1. The Heat Sink Geometry The ATS-07H-142-C2-R0 utilizes a **Fine Pitch design**. This provides a larger surface area within a small footprint (30mm x 30mm), allowing for efficient heat dissipation even in systems with restricted airflow. ### 2. push-PIN™ Attachment System This part features a specialized mounting mechanism: * **Performance:** It provides a secure attachment to the PCB. * **Consistency:** The pre-assembled springs ensure a precise pressure (load) is applied to the component, optimizing the thermal interface. * **Variety:** The system uses brass or plastic pins and is designed for 3.17mm (approx. 1/8") holes in the motherboard. ### 3. Thermal Interface Material (TIM) The "R0" suffix indicates the inclusion of a high-efficiency Thermal Interface Material. This is usually pre-applied to the base of the heat sink to eliminate air gaps between the component and the sink, facilitating better heat transfer. --- ## Thermal Performance Matrix | Velocity (LFM) | 100 (0.5 m/s) | 300 (1.5 m/s) | 500 (2.5 m/s) | 700 (3.5 m/s) | | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 7.22 | 3.51 | 2.58 | 2.14 | --- ### Usage Recommendations * **Target Devices:** Ideal for small form factor (SFF) electronics, telecommunications equipment, and industrial embedded systems. * **Airflow:** This model is optimized for **forced-air cooling** environments (where fans are present). * **Mounting:** Ensure the PCB layout includes the necessary 35mm pitch holes for the push-pin installation.