The **ATS-07H-06-C2-R0** is a specific part number for a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" attachment series designed for cooling electronic components like CPUs, GPUs, and high-power chipsets. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Thermal Resistance (Flowing Air)** | ~2.01 °C/W @ 200 LFM | | **Thermal Resistance (Static Air)** | ~14.90 °C/W | | **Spring Type** | Compression Spring | --- ### Key Components & Features #### 1. Heat Sink Body (Aluminum) The main body is constructed from high-grade aluminum. Aluminum is preferred for its excellent thermal conductivity and lightweight properties. The **Blue Anodized** finish isn't just for aesthetics; it provides a protective layer against corrosion and slightly increases emissivity for better radiation heat transfer. #### 2. Fin Design (Fine Pitch) The "06" in the part number typically refers to a specific fin configuration. ATS uses a high-aspect-ratio fin design to maximize the surface area within a compact 45mm footprint, allowing for superior heat dissipation in forced-convection (fan-cooled) environments. #### 3. Attachment Mechanism: Push-Pins The "H" in the part number indicates a specific hole pattern or attachment style. * **Plastic Push-Pins:** These allow for tool-less installation into pre-drilled holes on the PCB. * **Compression Springs:** These ensure a consistent and reliable downward pressure on the electronic component (die or package), which is critical for maintaining a thin, even layer of thermal interface material. #### 4. Thermal Interface Material (TIM) The "C2" suffix indicates that the part typically comes with **T766 Phase Change Material** or a similar high-performance thermal pad pre-applied to the base. This fills microscopic air gaps between the chip and the heatsink. --- ### Usage in Electronics * **BGA Cooling:** Primarily used for Ball Grid Array (BGA) components. * **Voltage Regulators:** Cooling high-wattage power management ICs. * **FPGA/ASIC:** Standard cooling for logic devices in networking and industrial telecommunications equipment. ---