The **ATS-07G-99-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient cooling of integrated circuits (ICs) like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Parameter | Specification | Details | | :--- | :--- | :--- | | **Material** | Aluminum | Blue Anodized Finish | | **Dimensions** | 45mm x 45mm | Square base | | **Height** | 20mm | Low profile for tight spaces | | **Fin Style** | Fine Pitch | Maximizes surface area | | **Attachment** | pushPIN™ | Spring-loaded attachment | | **Thermal Resistance** | 11.51 °C/W (Unducted) | At 100 LFM airflow | --- ### 2. Key Components & Features The "electronic" functionality of this part is passive, meaning it does not require power but is critical for the survival of active electronics. #### A. Fin Design (Cross-Cut) The unit features a cross-cut pattern that allows for multi-directional airflow. This is crucial in dense electronic enclosures where air may not flow in a single linear path. #### B. Thermal Interface Material (TIM) * **Pre-Applied:** This specific model comes with **T766** thermal interface material. * **Function:** It fills microscopic air gaps between the heat sink and the electronic chip to ensure maximum heat transfer. #### C. pushPIN™ Attachment System Instead of simple adhesive, this uses a mechanical system consisting of: * **Brass Push Pins:** Secure the sink to the PCB. * **Compression Springs:** Provide precise "Force-on-Die" pressure to ensure the TIM works effectively without cracking the silicon chip. --- ### 3. Part Number Breakdown (Nomenclature) Understanding the code helps identify the specific configuration: * **ATS:** Advanced Thermal Solutions (Manufacturer) * **07:** Part of the pushPIN™ series * **G:** Size/Material designation * **99:** Specific fin geometry/density * **C2:** Thermal performance/Material grade * **R0:** Revision/Packaging code --- ### 4. Application Use Cases This heat sink is typically found in the following electronic systems: 1. **Networking:** Switches and routers. 2. **Industrial PC:** Embedded systems requiring passive cooling. 3. **Power Supplies:** Cooling MOSFETs or power regulators.