The **ATS-07G-89-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is designed for cooling electronic components, specifically those in the BGA (Ball Grid Array) package family. --- ### 1. Technical Specifications Below are the primary mechanical and thermal specifications for this part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 35.00mm x 35.00mm | | **Height** | 20.00mm | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 7.94° C/W (@ 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Component Features #### A. Fin Design: Straight Fin This model utilizes a **straight-fin** geometry. Straight fins are ideal for "undirected" airflow or environments where the air moves in a consistent path across the board. The spacing is optimized to minimize pressure drop while maximizing surface area. #### B. Attachment: Push-Pin and Spring Unlike adhesive-based heat sinks, the `-R0` series uses a mechanical attachment system: * **Push-Pins:** Plastic pins that snap into pre-drilled holes on the PCB. * **Compression Springs:** These ensure a consistent, high-pressure contact between the heat sink base and the electronic component (CPU, GPU, or ASIC), which is critical for efficient heat transfer. #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. This eliminates the need for manual thermal paste application, ensuring a uniform layer that fills microscopic air gaps between the component and the metal. --- ### 3. Electronic Applications The ATS-07G-89-C2-R0 is typically used for the following electronic parts: 1. **Processors:** High-speed ARM processors or microcontrollers. 2. **FPGAs/ASICs:** Field Programmable Gate Arrays that generate significant heat in small footprints. 3. **Power Electronics:** Voltage regulators or high-speed switching components. 4. **Networking Chips:** Southbridge or Northbridge-style chipsets on motherboards. --- ### 4. Thermal Performance Data Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 7.94 | | 300 (1.5 m/s) | 3.23 | | 500 (2.5 m/s) | 2.32 |