The **ATS-07G-80-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for secure and efficient cooling of electronic components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications Below are the primary mechanical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 15.00mm | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | 18.99° C/W @ 100 LFM | | **Flow Orientation** | Vertical (Cross-Cut) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Design Components #### A. Fin Geometry (Cross-Cut) The unit features a **straight fin cross-cut** design. This allows for multi-directional airflow, making it versatile for systems where the direction of the cooling fan's exhaust might vary or where turbulent air is present. #### B. Push-Pin Attachment Instead of using adhesive tapes (which can degrade over time), this part uses a mechanical **push-pin and spring** assembly. * **Pros:** Provides constant pressure for better thermal contact. * **Reliability:** Resistant to shock and vibration. * **Ease of Use:** Pre-drilled holes in the PCB are required for installation. #### C. Thermal Interface Material (TIM) The part comes pre-applied with **T766 phase-change material**. This eliminates the need for manual thermal paste application, ensuring a uniform layer that fills microscopic air gaps between the heat source and the heat sink. --- ### 3. Thermal Performance Reference Thermal resistance indicates how effectively the heat sink dissipates heat. Lower values are better. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 18.99 | | 300 (1.5 m/s) | 8.82 | | 500 (2.5 m/s) | 7.08 | --- ### 4. Typical Applications * **Embedded Systems:** Cooling small-form-factor processors. * **Telecommunications:** Managing heat in high-speed networking switches. * **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators.