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  • ATS-07G-75-C3-R0

  • AI
    The **ATS-07G-75-C3-R0** is a high-performance electronic thermal management component, specifically a **Pin Fin Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ## Technical Specifications The following table outlines the key physical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Type** | Pin Fin (Cross-cut) | | **Length / Width** | 25.00 mm x 25.00 mm | | **Height** | 30.00 mm | | **Thermal Resistance** | 5.30°C/W (at 1.0 m/s airflow) | | **Compliance** | RoHS Compliant | --- ## Component Breakdown ### 1. pushPIN™ Attachment System Unlike adhesive-based heat sinks, the "C3" designation indicates the use of a **stainless steel spring and plastic push-pin**. This provides: * **Constant Pressure:** Ensures optimal thermal interface material (TIM) contact. * **Reliability:** Resistant to vibration and thermal expansion/contraction. * **Ease of Installation:** Pre-drilled holes in the PCB are used for quick mounting. ### 2. Pin Fin Geometry The "G" in the part number refers to the **Pin Fin** design. * **Omnidirectional Airflow:** Unlike straight-fin heat sinks, pin fins allow air to enter from any direction, making it ideal for systems with complex or unpredictable airflow. * **Surface Area:** The high density of pins maximizes the surface area for heat exchange within a small 25mm footprint. ### 3. Thermal Performance The **ATS-07G-75-C3-R0** is designed for medium-to-high density cooling. * **Low Airflow:** At 200 LFM (linear feet per minute), the thermal resistance is approximately **5.30°C/W**. * **High Airflow:** At 800 LFM, the resistance drops significantly to roughly **2.30°C/W**, indicating highly efficient heat transfer in forced-air environments. --- ## Applications This part is typically found in: * **Embedded Systems:** Industrial PCs and controllers. * **Telecommunications:** Networking switches and routers. * **Power Supplies:** Cooling voltage regulators and MOSFETs.
    ✨ Follow-up Questions
    • ⤷ What are the recommended PCB hole diameters for the pushPIN attachment?
    • ⤷ How does the blue anodized finish affect the thermal emissivity of this part?
    • ⤷ Is there a recommended Thermal Interface Material (TIM) to use with this specific model?