ATS-07G-75-C3-R0
AI

The **ATS-07G-75-C3-R0** is a high-performance electronic thermal management component, specifically a **Pin Fin Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors.
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## Technical Specifications
The following table outlines the key physical and thermal characteristics of this part:
| Characteristic | Specification |
| :--- | :--- |
| **Material** | Aluminum (Al) |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Fin Type** | Pin Fin (Cross-cut) |
| **Length / Width** | 25.00 mm x 25.00 mm |
| **Height** | 30.00 mm |
| **Thermal Resistance** | 5.30°C/W (at 1.0 m/s airflow) |
| **Compliance** | RoHS Compliant |
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## Component Breakdown
### 1. pushPIN™ Attachment System
Unlike adhesive-based heat sinks, the "C3" designation indicates the use of a **stainless steel spring and plastic push-pin**. This provides:
* **Constant Pressure:** Ensures optimal thermal interface material (TIM) contact.
* **Reliability:** Resistant to vibration and thermal expansion/contraction.
* **Ease of Installation:** Pre-drilled holes in the PCB are used for quick mounting.
### 2. Pin Fin Geometry
The "G" in the part number refers to the **Pin Fin** design.
* **Omnidirectional Airflow:** Unlike straight-fin heat sinks, pin fins allow air to enter from any direction, making it ideal for systems with complex or unpredictable airflow.
* **Surface Area:** The high density of pins maximizes the surface area for heat exchange within a small 25mm footprint.
### 3. Thermal Performance
The **ATS-07G-75-C3-R0** is designed for medium-to-high density cooling.
* **Low Airflow:** At 200 LFM (linear feet per minute), the thermal resistance is approximately **5.30°C/W**.
* **High Airflow:** At 800 LFM, the resistance drops significantly to roughly **2.30°C/W**, indicating highly efficient heat transfer in forced-air environments.
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## Applications
This part is typically found in:
* **Embedded Systems:** Industrial PCs and controllers.
* **Telecommunications:** Networking switches and routers.
* **Power Supplies:** Cooling voltage regulators and MOSFETs.
- ⤷
What are the recommended PCB hole diameters for the pushPIN attachment?
- ⤷ How does the blue anodized finish affect the thermal emissivity of this part?
- ⤷ Is there a recommended Thermal Interface Material (TIM) to use with this specific model?