The **ATS-07G-72-C2-R0** is a specific electronic component categorized as a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors to prevent thermal throttling or damage. ### 1. Technical Specifications The model number provides specific details about its material, finish, and thermal performance. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45mm x 45mm x 15mm | | **Thermal Resistance** | 5.11°C/W (at 100 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Physical Design Features The ATS-07G-72-C2-R0 utilizes a specific geometric structure to maximize cooling efficiency: * **Fine Pitch Fins:** The "72" in the part number often refers to the specific fin density or configuration within the series. Fine pitch designs increase the surface area available for heat exchange with the air. * **Push-Pin Attachment:** Instead of messy adhesives or clips, it uses a push-pin mechanism with a spring. This ensures consistent pressure against the chip, which improves thermal transfer. * **Blue Anodized Coating:** The blue finish isn't just aesthetic; it protects the aluminum from corrosion and slightly improves radiant heat emission. --- ### 3. Thermal Performance Indicators Thermal performance is measured by how much the temperature rises per watt of power dissipated ($^\circ\text{C/W}$). * **Unducted Flow:** At low airflow (100 LFM), the resistance is approximately **5.11°C/W**. * **High Airflow:** As air velocity increases (e.g., 700 LFM), the resistance drops significantly (to roughly **1.45°C/W**), making it highly effective in server or high-velocity fan environments. --- ### 4. Common Applications This specific size and performance profile are typically found in: 1. **Network Switches/Routers:** Cooling ASICs or high-speed processing chips. 2. **Industrial PCs:** Cooling embedded processors in fanless or forced-air enclosures. 3. **Power Supplies:** Managing heat for MOSFETs or power conversion modules.