The **ATS-07G-40-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Parameter | Specification | Details | | :--- | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions | Model Series: pushPIN™ | | **Material** | Aluminum | Blue Anodized Finish | | **Attachment Method** | pushPIN™ | Spring-loaded plastic pegs | | **Dimensions (L x W)** | 40mm x 40mm | Square footprint | | **Height (H)** | 15mm | Low profile design | | **Fin Style** | Straight Fin | Optimized for directional airflow | | **Thermal Resistance** | 14.55 °C/W (Unducted) | Performance at 100 LFM | --- ### 2. Design and Components The ATS-07G-40-C2-R0 consists of several key electronic packaging elements: * **The Heat Sink Body:** Constructed from high-quality aluminum to provide high thermal conductivity while remaining lightweight. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied. This is a phase-change material that fills microscopic air gaps between the component and the heat sink. * **pushPIN™ Attachment:** Instead of messy adhesives or heavy screws, it uses a brass or plastic pin with a high-tension spring. This ensures constant, uniform pressure (load) on the electronic chip, which is critical for heat transfer. --- ### 3. Thermal Performance (Airflow Data) Thermal resistance varies based on the velocity of the air passing through the fins (measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Resistance (Unducted) | Resistance (Ducted) | | :--- | :--- | :--- | | 100 | 14.55 °C/W | 2.48 °C/W | | 200 | 5.08 °C/W | 1.99 °C/W | | 300 | 3.01 °C/W | 1.72 °C/W | | 500 | 1.91 °C/W | 1.45 °C/W | --- ### 4. Application Use Cases This component is generally used in: * **Embedded Systems:** For cooling SoCs (System on Chips). * **Telecommunications:** Cooling signal processing units in switches or routers. * **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators.