The **ATS-07G-136-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic) | | **Thermal Resistance** | 2.22°C/W @ 200 LFM | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 35.00mm | | **Fin Style** | XC-Cut (Straight Fins) | | **Thermal Interface Material (TIM)** | T412 | --- ### Key Electronic & Mechanical Components #### 1. Heat Sink Body (Thermal Dissipator) The core component is made of extruded aluminum. Its primary role in an electronic system is to increase the surface area available for heat transfer. - **XC-Cut Design:** The fins are designed for maximum airflow efficiency across the component. - **Blue Anodization:** This is not just for aesthetics; the anodized coating provides a level of electrical insulation and protection against corrosion. #### 2. Push Pin Attachment Mechanism Instead of using adhesive tapes or soldering, this part uses **plastic push pins with integrated springs**. - **Function:** The springs provide precise, consistent pressure (preload) on the electronic chip, ensuring optimal contact between the die and the heat sink. - **Reliability:** This mechanical attachment is more vibration-resistant than thermal tape. #### 3. Thermal Interface Material (TIM): T412 The bottom of the heat sink comes pre-applied with **T412**. - **Role:** It fills the microscopic air gaps between the surface of the electronic component and the heat sink. - **Performance:** T412 is a high-efficiency thermal grease/pad that lowers the thermal contact resistance, allowing heat to flow more freely. --- ### Applications in Electronics This specific part is typically found in: * **Networking Equipment:** High-speed routers and switches. * **Industrial PCs:** Cooling processors in fanless or forced-air environments. * **Power Supplies:** Managing heat in high-output power converters. ---