ATS-07G-131-C2-R0
AI

The **ATS-07G-131-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like processors, FPGAs, and ASICs.
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### 1. Technical Specifications
The following table summarizes the primary physical and thermal characteristics of this component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Brass) |
| **Spring Type** | Compression Spring |
| **Thermal Resistance** | 3.60°C/W (at 200 LFM) |
| **Dimensions (L x W)** | 35.00mm x 35.00mm |
| **Height** | 20.00mm |
| **Fin Style** | Straight Fin |
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### 2. Key Components & Materials
To understand the electronic application of this part, we must look at its sub-components:
* **Heat Sink Body:** Made of extruded aluminum, which offers a balance between high thermal conductivity and low weight. The blue anodized coating protects against corrosion and slightly improves radiant heat transfer.
* **Push-Pin Mounting:** Unlike adhesive-based heat sinks, the **C2-R0** uses brass push-pins. This provides a constant pressure (clamping force) on the electronic chip, which ensures a consistent interface with the Thermal Interface Material (TIM).
* **Compression Spring:** The spring ensures that even under mechanical shock or vibration, the heat sink maintains contact with the heat source (the semiconductor die).
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### 3. Application Use Cases
This specific model is typically used in the following electronic environments:
1. **Telecommunications:** Cooling of high-speed networking chips.
2. **Embedded Systems:** Industrial PCs where mechanical stability is required (hence the push-pin instead of tape).
3. **Power Electronics:** Managing heat for voltage regulators and power modules.
### 4. Thermal Performance Data
Performance varies based on the airflow (Linear Feet per Minute - LFM) within the electronic enclosure:
| Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) |
| :--- | :--- | :--- |
| 100 | 0.5 | 7.22 |
| 200 | 1.0 | 3.60 |
| 300 | 1.5 | 2.65 |
| 400 | 2.0 | 2.15 |
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- ⤷
How does the 'C2-R0' suffix differentiate this model from other versions?
- ⤷ What are the PCB hole requirements for mounting this specific push-pin heat sink?
- ⤷ Can this heat sink be used with a custom Thermal Interface Material (TIM)?