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  • ATS-07G-131-C2-R0

  • AI
    The **ATS-07G-131-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like processors, FPGAs, and ASICs. --- ### 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 3.60°C/W (at 200 LFM) | | **Dimensions (L x W)** | 35.00mm x 35.00mm | | **Height** | 20.00mm | | **Fin Style** | Straight Fin | --- ### 2. Key Components & Materials To understand the electronic application of this part, we must look at its sub-components: * **Heat Sink Body:** Made of extruded aluminum, which offers a balance between high thermal conductivity and low weight. The blue anodized coating protects against corrosion and slightly improves radiant heat transfer. * **Push-Pin Mounting:** Unlike adhesive-based heat sinks, the **C2-R0** uses brass push-pins. This provides a constant pressure (clamping force) on the electronic chip, which ensures a consistent interface with the Thermal Interface Material (TIM). * **Compression Spring:** The spring ensures that even under mechanical shock or vibration, the heat sink maintains contact with the heat source (the semiconductor die). --- ### 3. Application Use Cases This specific model is typically used in the following electronic environments: 1. **Telecommunications:** Cooling of high-speed networking chips. 2. **Embedded Systems:** Industrial PCs where mechanical stability is required (hence the push-pin instead of tape). 3. **Power Electronics:** Managing heat for voltage regulators and power modules. ### 4. Thermal Performance Data Performance varies based on the airflow (Linear Feet per Minute - LFM) within the electronic enclosure: | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 7.22 | | 200 | 1.0 | 3.60 | | 300 | 1.5 | 2.65 | | 400 | 2.0 | 2.15 | ---
    ✨ Follow-up Questions
    • How does the 'C2-R0' suffix differentiate this model from other versions?
    • What are the PCB hole requirements for mounting this specific push-pin heat sink?
    • Can this heat sink be used with a custom Thermal Interface Material (TIM)?